Zeiss Enters Process Control Solutions Market

Zeiss of Oberkochen, Germany, is expanding into the process control market. The company says its new Process Control Solutions (PCS) business unit, will use its core technology solutions and partnerships to address a range of special needs for semiconductor customers. The new business unit will serve as part of the Zeiss Semiconductor Manufacturing Technology (SMT) business group and will draw on the company’s innovations in microscopy.



“We see a strong trend in semiconductors toward complex 3D chip structures and new materials,” explained Dr. Karl Lamprecht, head of SMT business group. “As development cycles lengthen and R&D costs climb, the role of metrology changes. Our customers need effective process control solutions delivering integrated, actionable information that speeds time to problem resolution and time to production. Zeiss has the technology and expertise to fulfill these requirements.” 



The company points out that the semiconductor manufacturing workflow has become increasingly challenging with shrinking structure sizes, ever more design sophistication, and hundreds of individual working steps. Fast and cost-effective process control solutions help ensure the functioning of semiconductor devices.

SMT Business Group to Use and Expand Upon Existing Products

The firm already supplies its portfolio of lithography optics, mask metrology, and repair solutions. Now, the company says it leverages its semiconductor equipment experience in the semiconductor process control solution market. 

In order to penetrate the semiconductor lab and fab space the business unit will use and expand upon the company’s existing portfolio of products, including its core proprietary microscopy technologies.

Key products to be deployed include its electron microscope products Zeiss Crossbeam and MultiSEM (the latter incorporates the company’s multi-electron-beam technology), the ion-beam microscope Zeiss ORION NanoFab, as well as the Zeiss Xradia Versa and Xradia Ultra non-destructive 3D X-ray microscope systems.