The adoption of the wide bandgap semiconductors, SiC and GaN, pushes the development of new power packaging solutions, according to the market research firm, Yole. The firm says that SiC technologies are becoming an essential solution to meet the industrial requirements. Yole forecasts that the market for SiC technologies will grow with a 29% CAGR between 2017 and 2023.
Yole says that the EV/HEV industry’s demand for high power density and mechatronics integration is also driving many power electronics innovations and that these power electronics use dedicated packaging solutions. System Plus Consulting, one of the Yole group of companies, looked at Power module packaging of ten modules for automotive applications from five different manufacturers.
“There is not yet a standardized package in automotive applications,” commented Farid Hamrani, Cost Engineer at System Plus Consulting.
Yole predicts that with continuous innovation, the market for power module packaging will achieve an 8.2% CAGR during the period 2017-2023, reaching a global sector of nearly US$ 2 billion by 2023.
The market research firm pointed to two major technology trends in power modules for automotive applications, over-molded double-side, cooled modules for hybrid cars and single-side cooled modules with pin-fin baseplates for fully electric cars. Yole also says that IGBT power modules dominate the automotive industry.
“The IGBT power module market grew 18.1% in 2017,” according to Dr. Milan Rosina, senior technology & market analyst, Power Electronics & Batteries at Yole. “No doubt today, that IGBT modules are driving the power module packaging materials business.”
In just the first half of 2018, Yole says that the IGBT module market grew over 20%, mainly with the boost from the EV/HEV sector, especially in China.
The business for power module packaging has grown to about US$1.2 billion, a just over a third of the total power module market, Yole estimates. “It is a very dynamic market, where continuous innovations and material enhancements and a lot of R&D investment are needed,” commented Alejandra Fuentes Suarez, technology & market analyst at Yole.