EV Group (EVG) of St. Florian, Austria, a supplier of wafer bonding and lithography equipment, reported that it received an order for the company’s EVG®120 automated resist processing system from VTT Technical Research Centre of Finland (VTT).
An existing customer of EVG’s wafer bonding and alignment systems, the research center is among the first to order the newest version of the EVG120 system. EVG improved the EVG®120 to deliver even greater reliability, throughput and process performance compared to the company’s previous-generation platform.
VTT Intends to Increase Capacity for Running Parallel R&D Projects
VTT plans to use the new EVG120 system to increase capacity for carrying out parallel R&D projects involving new and different coating materials, as well as to enable new research applications in “More than Moore” technology areas such as compoundsemi, MEMS, optoelectronics, and photonics.
New features of the updated system include separation of wet processing modules to enable constant conditions; chamber to chamber integrated chemistry cabinet for resist pumps and bottles (including support for high-viscosity resists), for improved process control and short dispense cycles Also, EV Group says that the updated EVG®120 offers a robot handling system that enhances throughput and makes the system more reliable.
Heini Saloniemi, manager, process engineering, at VTT stated, “After a thorough product evaluation of lithography coating systems, VTT selected the EVG120 in a competitive tender, with coating uniformity and repeatability of coating thickness among the key evaluation criteria. We look forward to receiving the new EVG120 system, which will enhance our lithography process capabilities and allow us to explore new avenues of research.”