Veeco Acquires the Advanced Packaging firm SSEC

Veeco Instruments Inc. of Plainview, New York USA, has acquired privately held Solid State Equipment Holdings LLC (SSEC), based in Horsham, Pennsylvania. SSEC is a developer of single wafer wet etch, clean and surface preparation equipment targeting advanced packaging, micro-electro-mechanical systems (MEMS), and compound semiconductors.

“SSEC is a highly successful process equipment company that is a great strategic fit with Veeco,” said John R. Peeler, Veeco’s chairman and CEO. “Their complementary and differentiated ‘soak and spray’ technology delivers single wafer control with the low cost of batch processing. SSEC extends our compound semiconductor and MEMS footprint, and represents a stepping stone to the high-growth advanced packaging market.”

According to Veeco, applications in 3D stacked memory, 3D system-on-chip and MEMS are fueling the demand for higher performance, smaller form factors, and lower power consumption in mobile devices, consumer electronics, and high performance computing.  Veeco points out that wearable electronics with more sophisticated sensing functions further drive growth in the MEMS market.

Herman Itzkowitz, SSEC’s Chief Executive Officer said, “Veeco is a dynamic market leader in compound semiconductor equipment for LED, power electronics, and wireless devices. Combining resources will enable us to accelerate growth and to pursue market opportunities in advanced packaging and MEMS. In addition, we have significant untapped potential in Asia and Europe, where Veeco’s impressive sales and service network will provide connectivity to key customers.”