EV Group (EVG) of St. Florian, Austria, a supplier of wafer bonding and lithography equipment, reported that the company received an order from the University of Tokyo for its EVG810LT plasma activation system.
The University of Tokyo intends to use the system for compound semiconductor research. The University installed the system at its Takagi & Takenaka Laboratory. The EVG810LT system expands the laboratory’s research capabilities which target the development of innovative MOSFET and electronic-photonic integrated circuits (EPICs) using III-V-on-insulator (III-V-OI) and germanium-on-insulator (GeOI) substrates.
According to the University, these substrates are designed to exceed the performance of conventional silicon semiconductors as well as silicon photonics, in which III-V materials including indium phosphide (InP), indium gallium arsenide (InGaAs), and germanium bond to silicon wafers.
The EVG810LT plasma activation system uses plasma to activate a wafer surface for low-temperature direct wafer bonding. EV Group says other customers have utilized the system in the high-volume production of silicon-on-insulator (SOI) wafers and backside illuminated CMOS image sensors.
Dr. Mitsuru Takenaka, associate professor at the Takagi & Takenaka Laboratory with the University of Tokyo commented, “3D integrated circuits with III-V compound semiconductors or germanium stacked freely on silicon semiconductors are expected to be among the breakthroughs to enhance the performance of the LSIs after the end of Moore’s Law. In support of our efforts, we adopted EV Group’s plasma activation system, the EVG810LT, to help us achieve lower temperature and high-quality wafer bonds.”
Hiroshi Yamamoto, representative director of EV Group Japan K.K., said, “It is a great honor that our system was selected to support the University of Tokyo’s leading-edge LSI device research. The innovative results at The Takagi & Takenaka Laboratory are expected to address the fundamental issues that the semiconductor industry currently faces.”
EVG plans to showcase the EVG810LT system at the SEMICON Japan exhibition being held December 13-15 at the Tokyo Bit Sight – Tokyo International Exhibition Center in Tokyo, Japan.