Feature

SDK Again Increases SiC Wafer Capacity

Showa Denko Kabushiki Kaisha (SDK) of Tokyo reported that the company intends to expand is production capacity of SiC sheets from 5000 wafers per month now to 7000 in September this year, and the company plans to attain production 9000 wafers in February 2019. After previously raising production capacity both …

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Graphene Engineering Innovation Centre (GEIC) Signs First Partners

The University of Manchester’s recently finished £60m Graphene Engineering Innovation Centre (GEIC) has agreed to establish the first in a series of industrial partnerships. The center intends to use the industrial partnerships to accelerate the commercialization of graphene in Manchester. First Graphene Ltd, Haydale Graphene Industries, and Versarien PLC have …

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POET Technologies Collaborates with Almae to Develop Laser Modules Using POET’s Optical Interposer Platform

POET Technologies Inc., a designer, developer, and maker of optoelectronic devices, announced the company has agreed to co-develop transmit device solutions with Almae Technologies SAS, a French-based producer of advanced photonic products. The companies intend to jointly develop, produce, and sell a series of laser modules using the POET Optical Interposer™ …

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ICS Cleanroom Opens After Refurbishment

UK’s Economy Secretary Ken Skates attended the reopening of Cardiff University’s new refurbished £4m Institute for Compound Semiconductors (ICS) Clean Room. The 225-square-meter Institute of Compound Semiconductors (ICS) Clean Room, located in the University’s Queen’s Building, has undergone a £600,000 refurbishment to improve room conditioning in preparation for new equipment. …

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WIN Semiconductor Releases New GaAs pHEMT Technology

WIN Semiconductors Corp of Taoyuan, Taiwan, a pure-play compound semiconductor foundry, has released a new GaAs pHEMT technology which incorporates monolithic PIN and vertical Schottky diodes with WIN’s high performance 0.1µm pseudomorphic HEMT process, PP10. According to the company, this integrated platform, PIH0-03, adds a highly linear vertical Schottky diode …

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NTT and Tokyo Institute of Technology Develop IC Capable of Wireless transmission of 100 gigabits per second in a 300 GHz band

Nippon Telegraph and Telephone Corporation (NTT), and Tokyo Institute of Technology, have succeeded in creating the world’s fastest 100 gigabit per second wireless transmission data rate in the 300 GHz band. They jointly developed the ultra high-speed wireless front-end IC that operates on a terahertz frequency band used to achieve …

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Plasma-Therm Acquires Plasma Etch Equipment Maker CORIAL

Plasma-Therm of St. Petersburg, Florida USA, a maker of plasma etch, deposition, and advanced semiconductor packaging equipment announced the successful acquisition of CORIAL, a France-based plasma processing equipment supplier. Plasma-Therm’s plasma-processing and advanced-packaging solutions are used in research, pilot manufacturing, and volume production of wireless, photonics, solid state lighting, MEMS/NEMS, …

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