TDK and Qualcomm Start Joint Venture RF360

Qualcomm Incorporated and TDK Corporation reported the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). In addition to being a Singapore company, RF360 Holdings will have a global presence with R&D and manufacturing and sales locations in Europe and Asia, and its headquarters will be in Munich, Germany.

Qualcomm says that the joint venture will enable its RF front-end (RFFE) business unit to deliver RFFE RFFE modules and RF filters for use in fully integrated systems of mobile devices and fast-growing business segments, including Internet of Things (IoT), automotive applications, connected computing, and others. The business being transferred constitutes a part of the TDK SAW Business Group activities.

Together with RF360 Holdings, Qualcomm Technologies, Inc. (QTI) says it will be ideally positioned to both design and supply RF systems from end-to-end.

RF360 Holdings will offer a comprehensive set of filters and filter technologies, including bulk acoustic wave (BAW), surface acoustic wave (SAW), and temperature-compensated surface acoustic wave (TC-SAW). Qualcomm says RF360 will use these technologies to support the broad range of frequency bands being deployed in networks around the world. Furthermore, Qualcomm says that RF360 Holdings will enable the delivery of RFFE modules from QTI that will include QTI designed and deployed front-end components. These components include GaAs, CMOS, SOI, a broad portfolio of Switches, Antenna Tuning, Low Noise Amplifiers (LNAs) and a leading Envelope Tracking solution.

TDK says that the acquisition will enable further work with Qualcomm. “The deeper collaboration with Qualcomm fits perfectly into our growth strategy,” said Shigenao Ishiguro, president and CEO of TDK Corporation. “It is a further step that aims to open up new promising business opportunities for TDK, while strengthening the company’s innovativeness and thus competitiveness in such attractive future markets as sensors, MEMS, wireless charging, and batteries. Our customers will clearly benefit from the resulting unique and comprehensive technologies and products portfolio.”