Solar-Tectic Gets U.S. Patent for Perovskite Thin-Film, Tandem Solar Cell

The United States Patent Office has granted Solar-Tectic a patent for tin perovskite thin-film, tandem solar cell. The tandem solar cell combines tin perovskite cell and a crystalline silicon thin film. According to Solar-Tectic of Briarcliff Manor, New York USA, the Patent #9,608,159 B2 covers all tandem solar cells with non-toxic perovskites and inorganic materials.

Ashok Chaudhari, CEO of Solar-Tectic, invented the tandem solar cell. The company points out that recently due to advances in perovskite materials, the materials have been promoted as a promising solution to the issue of solar cell efficiency.

Novel Design of Perovskite Tandem Cells with Crystalline Silicon Thin Film

The development of tandem solar cells combining perovskite and silicon (wafer) cells along with the extensive intellectual property that covers them has been widely reported, Solar-Tectic noted. However, the company contends that remarkably no one previously has developed a tandem cell combining perovskite and crystalline silicon thin-film.

In PERC, HIT, PERL, HJ, or perovskite/silicon tandem cells, wafer sized bottom poly- and monocrystalline silicon layers are typically 200-280 microns thick, according to Solar-Tectic. However, the company’s thin-film crystalline inorganic bottom layers can be made as thin as 20-30 microns with the same or similar efficiency.

Furthermore, they can be processed at much lower temperatures for lower production costs. The company also notes that the entire process is environmentally friendly since it uses non-toxic Sn (tin) for depositing the crystalline silicon thin-film material for both the bottom layer and the top, perovskite, layer. The process does not use toxic lead.

The company’s new patent is one among its “Tandem Series” of solar cell technologies which the company recently launched. The “Tandem Series” includes a variety of various proven semiconductor photovoltaic materials (such as III-V, CZTS, a-Si, etc) for the top layer on silicon (or germanium) bottom layer, on various substrates such as flexible glass and polyimide for R2R (roll-to-roll) processing.