Plainview, New York-based Veeco Instruments Inc. reported that ON Semiconductor ordered its Propel® High-volume Manufacturing (HVM) Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system. On Semiconductor ordered the Propel HVM tool after a successful beta evaluation of the system and intends to use the system for GaN power electronics production.
According to Veeco, the Propel GaN MOCVD tool offers the industry’s first single-wafer cluster platform. Veeco says it designed the Propel GaN MOCVD system specifically for high-voltage power-management devices such as those used in automotive, data centers; information and communication technology; defense; aerospace; and power distribution systems, among other applications.
“Our prior learning with Veeco’s K465i™ GaN MOCVD system drove us to investigate the Propel HVM platform for our production ramp,” said Marnix Tack, Ph.D., senior director of corporate R&D and Open Innovation at ON Semiconductor. “The beta test results demonstrated superior device performance with high uniformity and within-wafer and wafer-to-wafer repeatability while meeting our cost-of-ownership targets for six- and eight-inch wafers.”
Propel HVM Uses IsoFlange™ and SymmHeat™ Technologies
Veeco based the Propel HVM platform its single-wafer system with the company’s proprietary IsoFlange™ technology that provides homogenious laminar flow and SymmHeat™ technology that creates a uniform temperature profile across the entire wafer. Veeco says that the Propel HVM system enables the fabrication of power electronics, advanced LEDs, laser diodes, and RF devices, all with higher performance and production yields while ensuring very low cost-of-ownership.
Peo Hansson, Ph.D., senior vice president and general manager of Veeco MOCVD operations commented, “With its highly controlled doping, run-to-run stability, superior wafer uniformity, high productivity and uptime, Propel HVM extends the benefits of our TurboDisc® platform to a unique single-wafer architecture. ”
Veeco is discussing the power of its innovative MOCVD, and wet etch systems in the “5G: Where Are We and What’s Next?” track at the CS International Conference this week in Brussels, Belgium.