SDK Again Increases SiC Wafer Capacity

Showa Denko Kabushiki Kaisha (SDK) of Tokyo reported that the company intends to expand is production capacity of SiC sheets from 5000 wafers per month now to 7000 in September this year, and the company plans to attain production 9000 wafers in February 2019. After previously raising production capacity both in September 2017, and then in January 2018, SDK again decided to raise the production capacity due to the rapid growth of SiC power semiconductor market.

SDK notes that makers of electric vehicles are switching to SiC-based circuitry for vehicle charging and fast charging stands. Additionally, the company foresees that distributed power supplies for new energy and servers for data center servers, as well as inverter modules for rail cars, will switch to SiC.

SDK boasts that its SiC epi wafer feature low defect density and high uniformity of its high-grade epitaxial wafers, which is the highest standard in the industry. The company says it will continue to maintain its share of SiC epi wafer market. Also, the company says it will strive to deliver robust SiC wafers on time where demand is increasing.