MACOM Launches Silicon Photonic IC for 100G Transmission

M/A-COM Technology Solutions Inc. (“MACOM”), announced the release of the MAOP-L284CN, a silicon photonic integrated circuit integrated with lasers (L-PIC™) for a 100G transmission for CWDM4 and CLR4 applications. MACOM developed the Silicon Photonic IC to meet the needs of major Internet content providers such as Amazon, Microsoft, Google, and Facebook.

According to MACOM such hyper-scale datacenters require high-speed interconnect solutions that are power efficient, compact and cost-optimized. MACOM attached its Etched Facet Technology (EFT) lasers to the Silicon PIC using its proprietary Self-Alignment process (SAEFT™) with high coupling efficiency.

160309-MACOM-LPIC

MACOM attached its Etched Facet Technology (EFT) lasers to the Silicon PIC using its proprietary Self-Alignment process (SAEFT™) with high coupling efficiency. MACOM claims that the SAEFT process offers a power-efficient solution at reduced manufacturing cost.

MACOM’s MAOP-L284CN features four, high-bandwidth Mach-Zehnder modulators integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM multiplexer.

Each channel operates at up to 28 Gb/s. The L-PIC™ works on a standard single mode optical fiber. The L-PIC includes integrated tap detectors for fiber alignment, system initialization and closed loop control. MACOM says that the only optical requirement for implementing this device into QSFP28 transceiver applications is a single fiber aligned to the output edge coupler.The device die measures 4.1 x 6.5 mm.

MACOM is also offering the MASC-37053A matched with this L-PIC™ for optimized performance and power dissipation. The MASC-37053A modulator driver is integrated with CDR.

“Silicon-based photonic integrated circuits, or PICs, enable integration of optical devices such as modulators and multiplexer onto a single chip. We believe that MACOM’s L-PIC™ solves the key challenge of aligning lasers to the silicon PIC with high yield and high coupling efficiency, making the adoption of Silicon PICs a reality for high-speed optical interconnects within the Datacenter,” said Vivek Rajgarhia, vice president of strategy, High-Speed Networking, for MACOM.

 MACOM is offering private demonstrations of its L-PIC™ at OFC 2016, Booth #3101, March 22-24th in Anaheim, CA.