Leti Extends 300mm Silicon-based Wafer Line

During IEDM in San Francisco, California USA, Leti, a research institute at CEA Tech, announced an extension of its 300mm silicon-based wafer line. The new 300mm silicon-based wafer line is intended to open new R&D pathways for its industrial partners.

According to Leti, the extension will allow new innovative technological modules to be integrated into, or made compatible with, industrial flows,
In this way, the research institute says that new wafer line will completely pioneer technology routes for edge AI, photonics, power electronics, HPC, in memory computing, and other high-end applications.

Line Expected to Accelerate Projects with Fab Partners

CEA-Leti says that the 300mm wafer-line extension will accelerate innovation projects with fab partners using 300mm wafers. Targeted technological research and development routes and related targeted applications for the 300mm line extension include:

  • photonics: III-V on silicon, integrated photonics
  • power electronics: insulated-gate bipolar transistors (IGBT)
  • vertical image sensors
  • HPC and edge AI: FD-SOI and derivatives, such as sequential stacking and Si qubits for quantum computing
  • memory: phase-change RAM (PCRAM), oxide-based resistive memory (OxRAM), conductive-bridging RAM (CBRAM)

“Our 300mm line will help Leti continue this strategy by accessing dimensions that make it possible to address the pressing challenges associated with emerging technologies, such as quantum, nanowires and sequential 3D integration,” said Emmanuel Sabonnadière, CEA-Leti CEO. “CEA-Leti’s industrial partners are now able to develop or test their disruptive technologies and their designs on state-of-the-art equipment, while benefiting from the institute’s R&D expertise, to achieve improved component performance, direct comparison with the ecosystem and easier technology transfers from lab to fab.”

Financing from the Auvergne Rhone Alpes region for the acquisition of a 193nm immersion lithography tool makes the implementation of the 300mm line possible. The acquisition of the lithography tool is the cornerstone of CEA-Leti’s investment plan of 2017-2018. The French Government also contributed financially to the second phase of the plan (2018-2019).