Infineon Technologies AG of Munich, Germany reports that it has acquired Siltectra GmbH, a start-up located in Dresden. The start-up, which was established in 2010, has developed an innovative technology (Cold Split) to efficiently process crystal material with minimal loss of material compared to common sawing technologies.
After the acquisition is completed, Infineon intends to use the company’s Cold Split technology to split silicon carbide (SiC) wafers, thereby doubling the number of chips from one wafer.
Venture capital investor MIG Fonds, the primary shareholder of Siltectra and Infineon agreed on a purchase price of 124 million Euros (about US$140 Million).
Dr. Reinhard Ploss, CEO of Infineon commented, “Thanks to the Cold Split technology, the higher number of SiC wafers will make the ramp-up of our SiC products much easier, especially regarding further expansion of renewable energies and the increasing adaptation of SiC for use in the drive train of electrical vehicles.”
Also, Dr. Jan Richter, CTO of Siltectra said, “Having shown that the Cold Split technology can be used at Infineon in principle, we will now work together to transfer it to volume production.”