GaN Systems Publishes White Paper for Using the RC Thermal Spice Model to Predict Thermal Behavior of its GaNPX Product

GaN Systems of Ottawa, Ontario Canada, reports that the number of its customers designing and deploying power systems using the company’s GaN transistors has surged. According to the firm, the increased adoption of its GaN transistors is because customers have recognized that GaN devices significantly improve both power efficiency and power density. Also, GaN Systems notes that using GaN transistors instead of legacy silicon components enables customers to use them in 50 W to 50 kW power systems that are as low as one-fifth the size and one-third the weight.

GaN Systems says that to support customers who are modeling new systems using SPICE simulations, it has released individual computer models for each product. The company has also published a new whitepaper, GN007, “Modeling Thermal Behavior of GaN Systems’ GaNPX® Using RC Thermal SPICE Model”.

The GN007 whitepaper can be downloaded from the Download section of the company website. Specifications for individual models can also be downloaded from their respective product pages.
GaN Systems’ transistors come in a GaNPX® package, which the company designed for extreme current and speed. The low profile GaNPX package boasts high power dissipation and low inductance, which enables fast, MHz power switching. The company says that its customers can now verify the optimal thermal performance of the package using the SPICE model protocol demonstrated in the GN007 whitepaper.

“Our customers are constantly pushing on design limits that only our GaN can enable,” stated Larry Spaziani, VP of sales and marketing, GaN Systems. “We’ve invested in expert thermal simulations that use state-of-the-art Finite Element Analysis tools to model our best-in-class power devices. The models have been converted into easy-to-use SPICE models and have been verified both in multiple simulation environments and in the test laboratory.”