GaN Systems of Ottawa, Ontario Canada, says it has created a set of LTSpice simulation files that helps power system design engineers quickly and confidently simulate designs prior to building hardware. The simulation files, which are available for download, help designers develop the proper layout to increase efficiency and power density in their GaN-based system designs.
The LTSpice models allow for a variety of inputs and simulations options. Users can select the product of interest and then select the LTSpice button. Additionally, the company’s LTSpice application notes GN007 and GN008 can be found on the GaN Systems website.Also, the LTSpice model user guide helps engineers model systems at three levels, ranging from an initial overview of circuit performance to a detailed analysis that allows fine tuning of the design.
GaN Systems LTSpice Model Does Simulations at Three Levels
Level 1 includes a basic adjustment and analysis of switching speeds. The company optimized Level 1 for fast simulations. Level 2 offers Level 1 features and adds thermal inputs and Cauer thermal RC network transient models for simulation of the device’s junction temperature and the self-heating effect. Level 3 adds to Level 2 features. In addition to Level 2 features, Level 3 includes parasitic losses and offers the most accurate model, but Level 3 has the longest simulation times.
The company performed a test to compare GaN E-HEMT switching losses were recorded using a half-bridge, double-pulse test circuit and those predicted with the LTSpice model simulation. GaN Systems found the difference between the actual measurement and the simulation to be less than 5 percent, a very good number for Eon/Eoff accuracy.
Larry Spaziani, GaN Systems VP of Sales and Marketing, commented, “Rarely do designers use spice simulation to estimate Eon/Eoff; with our models they can. We expect that this tool will help designers more fully understand GaN technology and accelerate their design completion.”