Oxford Instruments reports that the Fraunhofer Institute for Photonic Microsystems in Dresden, Germany has installed the Oxford Instruments FlexAL system for plasma-enhanced and thermal ALD at its Center for Nanoelectronic Technologies.
The new tool can be used in research and development of processes depositing metal oxides for the fabrication of ultra-thin 3D capacitors and the development of new and unique metal ALD processes. The new tool can be used for research and development on processes for metal oxides for ultra-thin integrated 3D capacitors and the development of new and unique metal ALD processes.
Oxford Instruments says that the system can also be used as a platform for combinatorial screening including in-situ metrology and standardized tests for ALD/PEALD precursor development serving gas and chemical supplying companies. The Fraunhofer Institute indicated that the FlexAL will serve as a 200mm PEALD tool for the MOEMS pilot line at the Fraunhofer IPMS.
The Institute chose the Oxford Instruments FlexAL PEALD system after a rigid tendering process because of its capabilities as a high-end ALD research and development tool. FlexAL’s design reportedly enables a broad range of processes enabled including the combination of plasma and thermal processes into one fully automated procedure.
“The proven performance and versatility of the Oxford Instruments FlexAL together with the availability of multiple room temperature variants of PEALD processes made it the ‘system of choice’ for the Center for Nanoelectronic Technologies,” said Dr. David Haynes, sales, service and marketing director, Oxford Instruments Plasma Technology.