EV Group (EVG), a leading supplier of wafer bonding and lithography equipment based in St. Florian, Austria, has received the 2017 Austrian Innovation Award, known as the “Staatspreis Innovation 2017”. Judges chose the award winning company from 485 competing firms in the 37th Austrian Innovation Awards. Austria Wirtschaftsservice GmbH (aws) organized the Innovation Awards on behalf of Austria’s Ministry of Science, Research and Economy.
The company, which provides its wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, won the award for the development of its SmartNIL® nanoimprint lithography technology. The innovative technology enables micro- and nano-structuring of wafers and other substrates through transferring minuscule structures from a stamp to a polymer material.
The company claims that uniform contact between the substrate and the re-usable imprinting stamp can be achieved even with microscopically small (sub-100-nanometer) structures. Applications for the technology include semiconductor and optical fabrication, diagnostics and drug discovery, and water quality screening, as well as medical device manufacturing for DNA and protein analysis.
Vice Chancellor and Federal Minister Dr. Reinhold Mitterlehner presented this highest federal accolade for innovative companies in Austria on March 28 at an awards ceremony at the Hall of Sciences in Vienna.
“Receiving the Staatspreis Innovation 2017 is a huge acknowledgment for us as well as confirmation of our Triple-i philosophy of invent-innovate-implement,” said Erich Thallner, who founded EVG together with his wife Aya Maria in 1980. Today, Erich serves as the company’s president and executive board member.
He added, “The great effort of all teams involved in this product and process development, as well as the vision of our company and all of its employees to always be first in exploring next-generation applications, is the basis for our success.”