Element Six of Santa Clara, California USA, announced the development of a new chemical vapor deposition (CVD) grown thermal grade of synthetic diamond, Diafilm™ ETC700. The thermally and electrically conductive material is uniquely suited to manage heat in high frequency, high power density devices, according to Element Six.
With a thermal conductivity of up to 700 W/mK, Diafilm ETC700 CVD diamond boasts thermal conductivity that is three times that of alternative ceramic solutions. Furthermore, Element Six says, this all-diamond solution does not require the metal coatings typical of other heat management materials. The absence of such metal coatings results in reduced frequency dependent conductive losses, the company says. Also, according to the company, Diafilm ETC700 outperforms all other common metal solutions and commercially available metallized, non-diamond heat spreader materials.
Highest Known Thermal Conductivity
Element Six notes that the material’s larger conduction cross-section improves ground-plane isolation, enabling better RF performance. The company says that while the bulk electrical conductivity reduces conductive losses at higher frequencies and reduces capacitive coupling between ground planes at low frequencies, Diafilm ETC700 maintains a high bulk thermal conductivity.
Element Six contends that its range of Diafilm TM heat spreaders have the highest known thermal conductivity of any solid material at room temperature and are available in a range of sizes, thicknesses, and levels of metallization. The addition of Diafilm ETC700 expands Element Six’s portfolio to six material grades spanning several levels of electrical performance and cost points, as well as thermal performance ranging from 700 W/mK to 2000 W/mK.