SiGe Semiconductor Launches Second-Generation Higher Efficiency WiMAX Power Amplifier in Small QFN Package
Source/Type: Press Releases - As issued by company

August 28, 2010... SE7271T Delivers Highly Integrated, Single PA Solution for
2.3-2.4 GHz and 2.5-2.7 GHz Designs Without Compromising
Performance, Reducing External BoM Count and Cost

Andover, Massachusetts USA -- SiGe Semiconductor,
Inc., a leading supplier of silicon-based radio frequency (RF) power
amplifiers (PAs) and front end modules (FEMs), has further expanded its
series of power amplifiers with the release of the SE7271T. A single
high-power PA which can cover both 2.3-2.4 GHz and 2.5-2.7 GHz WiMAX
bands, the device reduces bill of materials (BoM) count and cost for
USB dongles, data cards, mobile Internet devices and WiMAX-enabled
handsets.

A photo accompanying this release is available at
http://www.globenewswire.com/newsroom/prs/?pkgid=7924

Commenting on the device, Sanjiv Shah, Marketing Director for WiMAX
Products at SiGe, said, "Our proven system knowledge and device
integration has enabled us to deliver this compact, small footprint PA
with unequalled power added efficiency." He added, "WiMAX ultimately
stands for freedom and mobility. With the SE7271T's low current
consumption, we are delivering the battery life that consumers have
come to expect in mobile devices."

The new, highly integrated single-die PA is fully matched with a step
attenuator, power detector and harmonic filter all in a 3mm x 3mm x
0.6mm Quad Flat No Lead (QFN) package. The integrated impedance match
combines with the product's functionality to create a "plug-and-play"
solution that both simplifies the design of mobile WiMAX products and
improves their manufacturability. The lower current consumption and
higher efficiency of the SE7271T reduce current draw and leads to
improved battery life in WiMAX-enabled handsets, mobile Internet
devices and laptops. PA current consumption is critical in USB dongles,
where the limits on available power supply current typically force
reductions in the RF output power of less-efficient PAs, reducing
network coverage and data rate.

Shah commented, "Our competitors struggle with delivering to customers
the key value points for the evolution of mobile WiMAX products.
Competitive products are physically larger or are not compliant with
the temperature range required for data cards and USB dongles. And some
don't cover the complete 2.5 GHz WiMAX band. Full 2.3-2.7 GHz coverage,
increased efficiency at high RF power levels, -40 to +85 degree Celsius
operating temperature range, reduced package height -- these are
critical performance areas for mobile WiMAX PAs. The SE7271T delivers
on all of them."

According to Dell'OroGroup, a leading provider of market information
about the networking and telecommunications industries, WiMAX
subscribers are expected to rise from 7 million in 2009 to 69 million
by 2013.

"Whether using wired or wireless networks, today's consumers expect
broadband speed and performance. WiMAX is the next-generation standard
for delivering wireless high-bandwidth connectivity in fixed and mobile
environments, and our radiofrequency PAs and FEMs deliver the
reliability, flexibility, and performance OEMs require and WiMAX
consumers demand." Shah concluded, "The SE7271T provides our customers
with an integrated solution for their designs. The reduced design time
it supports, with the smallest footprint for its functionality as well
as the reduction of the number of components required and cost, all
make it a device of choice for USB dongles, data cards, mobile Internet
devices and WiMAX-enabled handsets."

The SE7271T comes in a small lead and halogen free, RoHS-compliant, 3mm
x 3mm x 0.6mm QFN package.

Pricing and availability: The SE7271T is priced at US$2.22 in
quantities of 10,000 units. It is in production now and is offered with
product and evaluation board datasheets and extensive application notes
surrounding the use and implementation of the device.

SiGe's renowned customer support is readily available to assist
customers in designing, upgrading or retrofiting the SE7271T into their
application designs to optimize performance.

Please contact SiGe for an up-to-date list of reference designs using
the SE7271T.

About SiGe Semiconductor

SiGe Semiconductor is a leading provider of highly integrated RF
semiconductor front end solutions that enable wireless connectivity
across a wide range of applications. Our innovative solutions integrate
multiple RF functions into a single semiconductor device to deliver an
optimal combination of performance, power output and efficiency, and
size. Our predominant use of standard silicon based processes and
fabless manufacturing model enables us to achieve high levels of
functional integration, leverage the economies of scale of high volume
manufacturing technology, maintain low costs and accelerate our
time-to-market. We have shipped more than 500 million front end
solutions since our inception, primarily consisting of Wi-Fi(TM) front
end modules and power amplifiers.

About SiGe Semiconductor's Lead-Free Initiative

The use of lead in the design and manufacture of electronic products is
an increasing environmental concern. In support of industry-wide
initiatives to protect the environment, all SiGe Semiconductor, Inc.
products we ship today are lead-free and RoHS compliant.

This news release may contain certain forward-looking statements. All
statements, other than statements of historical fact, included herein
are forward-looking statements that involve various risks and
uncertainties. There can be no assurance that such statements will
prove to be accurate and actual results and future events could differ
materially from those anticipated in such statements. Forward-looking
statements are based on the estimates and opinions of management on the
date the statements are made, and SiGe Semiconductor, Inc. does not
undertake an obligation to update forward-looking statements should
conditions or management's estimates or opinions change.




enabling wireless multimedia(R)





CONTACT: SiGe Semiconductor, Inc.
North America/Europe Technical and Press:
John Brewer
+1.978.327.6877

Technical Asia:
Daniel K. Ko
+852.3428.7260


Techworks Asia Ltd.
Press Asia:
Glenn Howes
+852.2525.8977

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