XPAK MSA Group Announces Build-to Specification Availability, Enhancements to Small-Form-Factor 10-Gigabit Ethernet Standard
Source/Type: Company News Releases

September 3, 2002... SAN JOSE, Calif.
Group Membership Growth Shows Increased Industry Support

The XPAK Multi-Source Agreement (MSA) group today announced that Revision 2.0, the "build-to" specification, of the XPAK 10-Gigabit Ethernet optical module form factor is now available.

The group also announced enhancements to the original XPAKspecification, and said that its membership has grown to 21 companies, which demonstrates growing acceptance of and support for the XPAK specification throughout the enterprise, storage area network (SAN) and switching center market segments.

The XPAK specification, initially announced by Infineon, Intel and Picolight, uses the electrical interface and register set defined by the XENPAK MSA. It defines mechanical, thermal and electromagnetic interference (EMI) mitigation features for a reduced-size, pluggable 10-Gigabit Ethernet module that is PCI-compliant in height, width and bezel opening.

Revision 2.0, the build-to specification, contains a number of enhancements that were developed in response to input from users and MSA members, and allows designers to lay out their small-form-factor boards with confidence that they will be in full compliance with the specification.

Because the PCI application in high-end servers is one of the earliest and largest market segments for small 10-Gigabit Ethernet pluggable modules, the XPAK organization created a specification that ensures accurate PCI compliance and tight EMI performance. This will enable more traditional telecommunication and data communication equipment makers to take advantage of the early market demand.


XPAK Specification Enhancements

The XPAK form factor offers levels of density, power efficiency and ease-of-integration that enable network equipment manufacturers to cost-effectively implement 10-Gigabit Ethernet links of up to 10 kilometers, which represent 80 percent of the 10-Gigabit Ethernet port applications.

In response to user and member requests, several additions hav been made to the original XPAK specification, which initially targeted PCI-compliant NIC (Network Interface Card), HBA (Host Bus Adapter) and TCA (Target Channel Adapter) applications. Now included are tall-profile, thermally enhanced specifications for 8-across switch environments and a mid-board mounting system for telecommunications applications. In addition, there are now module guide system mounting options for front-bezel or behind-bezel EMI sealing to accommodate either plated or painted faceplates.


MSA Membership Mushrooms

The XPAK MSA also announced that it has dramatically increased its membership since the group was announced in March 2002, with memberships now available at three levels. Participating members build modules meeting the XPAK MSA, sponsoring members are customers for modules that support the MSA, and contributing members are interested companies willing to support the MSA development (for example, integrated circuit vendors).

Eight new participating members have been added to the roster: blaze Network Products, E2O Communications, Fujitsu Quantum Devices, Kodeos Communications, Network Elements, Optium Corp., Pine Photonics and Red Clover Networks. These join the previous participating members, Infineon Technologies, Intel, Molex, Picolight and Tyco Electronics.

Two new sponsoring members, JNI Corp. and Spirent Communications, have joined previous sponsoring members Intel, McData Corp. and QLogic Corp.

The initial four contributing members are Broadcom, Forte Development, OEPIC Inc. and Quake Technologies.


About XPAK

The XPAK MSA builds on the electrical interface and register set defined by the XENPAK MSA, using the same 10-Gigabit Ethernet XAUI electrical interface over a 70-pin RFT-style connector in its initial implementation.

However, XPAK reduces the size to enable space-constrained application segments to transition to 10-Gigabit implementations. The small footprint and capability for double-sided mounting on a printed circuit board offer increased densities to switch and router manufacturers.

The low height, limited depth and single-sided mounting capability of the XPAK form factor also enable PCI card applications, and the recent enhancements expand the applications to include switch and telecommunications environments. The MSA accommodates all optical and copper PMDs, and maintains outstanding thermal characteristics even at its size.

The XPAK form factor is designed specifically to increase density for enterprise, SAN and switching cente applications by enabling up to 20 devices to be installed on a single 17-inch printed circuit board. XPAK supports 10-Gigabit Ethernet and Fibre Channel optical links from 2 meters to 10 kilometers, and is intended to eventually support links of up to 40 kilometers.


Participating Member Contacts

Blaze Network Products
twhitaker@blazenp.com

E2O Communications
jiida@e2o.com

Fujitsu Quantum Devices
hjii@fcsi.fujitsu.com

Infineon Technologies
rami.kanama@infineon.com

Intel
robert.zona@intel.com

Kodeos Communications
b.schreder@kodeos.com

Molex
jneer@molex.com

Network Elements
rsavara@networkelements.com

Optium Corp.
phallemeier@optiumcorp.com

Picolight
david.kabal@picolight.com

Pine Photonics
bltwu@pinephotonics.com

Red Clover Networks
gzhang@redclovernetworks.com

Tyco Electronics
rdatkins@tycoelectronics.com


CONTACT: For Picolight Inc.
Carolyn Fromm, 949/260-1300
carolyn_fromm@benjamingroup.com

or

For Intel Corp.
Mary-Ellin Brooks, 408/765-0727
mary-ellin.brooks@intel.com

or

For Infineon Technologies
Joe Fowler, 650/691-1488
joe@fscomm.com

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