SolidStateLighting.net             
News  |  Events  |  Jobs  |  Primers/Library Contact Us  
Compound Semi Online rss feeds - CompoundSemi.com - All News
Sponsored Links

Editorial: Bill Kroll's Formula for Forging Stronger Partnerships with Suppliers
 
... At our Compound Semi Vision 2007 meet in June, our "emeritus" co-chair Bill Kroll, Chairman and CEO of Matheson Tri-Gas, treated Vision attendees to an excellent talk on the importance of forging stronger partnerships with suppliers. The topic is of such critical importance to our compound semi community that...
Jump down to the full story

Features:
Get your CS News
via email
Catching up?
Check the list of
recent headlines
(the last 2 weeks)

 


TDI Makes InGaN Substrates Available
CompoundSemi News Staff

August 20, 2007...Technologies and Devices International, Inc. (TDI), a developer and supplier of nitride semiconductor materials headquartered in Silverspring, Maryland USA, announced the availability of what the company says are the world's first InGaN substrates. InGaN is used in the production of GaN-based blue, green, white, and UV LEDs in addition to laser diodes. The structural mismatch between InGaN epitaxial structures and the conventional substrates they are on is known to greatly reduce performance. “Crystal lattice and thermal match between the substrate and the overgrown InGaN device has been predicted for a long time to reduce defects in the light emitting regions, increase light emitting efficiency and device lifetime. With these substrates, this is now possible," Alexander Syrkin, a senior crystal growth specialist at the company said.

The substrates consist of an InGaN layer deposited on 2-inch GaN/sapphire template. The InN content in the InGaN layers ranges from 5 to 20 mol. percent. Volume production is expected to begin in early 2008. Vladimir Dmitriev, President and CEO of TDI stated, "Since the first demonstration of high quality InGaN materials grown by hydride vapor phase epitaxy (HVPE) in 2006, we have been receiving continuous requests from our customers regarding these new products. Today we are pleased to announce the expansion of our substrate materials offering to include InGaN substrates. Support provided by the US Department of Energy and Department of Defense for this product development is greatly appreciated. We view this effort as one of the key components to enable advanced light emitting devices, particularly for solid state lighting applications." Company News Release

Goodrich's SUI Team to Continue InGaAs Night Vision Technology Development for DARPA
CompoundSemi News Staff

August 20, 2007...Goodrich Corporation of Charlotte, North Carolina USA, was again selected by the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) to continue development of indium gallium arsenide (InGaAs), night vision technology. Specifically the company will continue to develop visible and shortwave infrared focal plane arrays for use in passive, night vision systems. The company was first awarded the multiphase DARPA contract in September 2005. (Ref: Coverage). Goodrich’s SUI team (previously a company called Sensors Unlimited Inc.), based in Princeton, New Jersey USA, developed the design and production methods of shortwave infrared cameras and systems utilizing InGaAs imaging technology for industrial, commercial, military, agricultural and scientific markets.

Edward Hart, Vice President and General Manager of Goodrich's SUI team, "Our team has successfully completed the first phase of this contract and we now look forward to taking the technology to the next level. We welcome the opportunity to carry on this important initiative with DARPA and their innovative MTO group. The focus of this next phase of development will be to raise the resolution of the camera we developed in the first phase and make the imager more sensitive, allowing for better night vision capabilities." Company News Release

GSM Power Amplifier Technology Declining Slower than Anticipated, ABI Research Says
CompoundSemi News Staff

August 20, 2007...ABI Research (ABI) has revealed that the demand for GSM and other 2G RF power amplifiers has been shrinking. However, the use of higher efficiency power amplifier designs has been increasing. “Though basic GSM is slowly declining, EDGE has satisfied the data needs of many users to a greater extent than anticipated. At the same time, many operators are becoming more wary of big 3G-related spending. The result is that such GSM-based systems have enjoyed a longer life-cycle, which in turn stretches out the growth period for 3G. That has a direct impact on what happens in the power amplifier and devices market,” said research director Lance Wilson.

The company said that Chinese vendors, led by Huawei Technologies and ZTE, have become more active in the RF power amplifier market. In this way ABI says, Chinese vendors are beginning to have an effect on the device market. ABI notes that high-efficiency RF amplifiers for wireless infrastructure are beginning to enter the mainstream. ABI predicts that these will be seen in increasing quantities over the next five years. ABI points out that greater amplifier efficiency translates to lower base station costs, in both initial price, and in lower power consumption and operating cost. ABI Research News Release

Kyma Adds New Sizes to Native Semi-Insulating GaN Substrate Product Line
CompoiundSemi News Staff

August 15, 2007...Kyma Technologies Inc., a supplier of nitride materials, products, and services located in Raleigh, North Carolina USA, reported the availability of its new 25mm x 25mm native semi-insulating GaN (SI GaN) substrates. The new substrates add to the company’s portfolio of SI GaN substrates which also includes: 10mm x 10mm and 18mm x 18mm substrates.

Kyma’s expanded SI GaN product line has received strong financial support from the US Air Force and US Missile Defense Agency (MDA) and from military collaborations in SI GaN related materials and devices including working with EOC, US Air Force Research Laboratory (AFRL), US Naval Research Laboratory (NRL), and US Naval Surface Weapons Center (NSWC).

Dr. Edward Preble, Kyma’s Chief Operating Officer, commented, “Our 25mm x 25mm native SI GaN product has excellent resistivity properties just like our smaller SI GaN substrates, as corroborated by recent electrical resistivity mapping measurements carried out by Tim Bogart, one of our collaboration partners at the Electro-Optics Center (EOC) of Penn State University. The larger size and availability are the results of yield improvements in our native SI GaN boule growth and wafering processes. We have also produced limited quantities of 30mm x 30mm high quality native SI GaN substrates and plan to announce their availability in the coming months.” Company News Release

JDSU Makes Diode Laser Available with Twice the Power and Highest Brightness
CompoundSemi News Staff

August 15, 2007...JDSU announced the general availability of its 2495-L3 Series 808 nanometer (nm) fiber-coupled diode laser. According to JDSU, the diode laser incorporates new chip technology that translates to a more reliable and less expensive laser solution for many industrial, dental and medical applications. JDSU also pointed out that the laser generates twice the power of previous offerings and provides the highest level of 808 nm brightness among commercially available single-emitter fiber coupled diode lasers.

"As the diode laser industry has matured, JDSU has leveraged its expertise in the telecom space and applied it to the industrial sector, bringing higher performance and lower cost diode laser solutions to the market," said Alex Schoenfelder, vice president and general manager of JDSU's Integrated Photonics business unit. "The 2495-L3 Series not only provides a more elegant offering for high-precision laser applications, it also opens the door for JDSU to participate in new markets."

JDSU indicated that the dental and medical fields have had growing demand for the use of 808 nm diode lasers. For example, Japan has certified this wavelength as the approved frequency for specific procedures. For soft tissue dental processes, the 2495-L3 diode laser allows a dentist to more accurately treat diseased gum tissue without disturbing surrounding healthy tissue. Company News Release

Kopin to Expand Production Facility
CompoundSemi News Staff

August 15, 2007...Kopin Corporation, a leading maker of micro displays for consumer and military applications, announced plans to enlarge and increase the production capacity of its Taunton, Massachusetts USA production facility. The company indicated that the increased space and capacity are needed to keep up with demand for micro displays and hetero junction bipolar transistors.

The company made the announcement during a ceremony at Kopin's world headquarters in Taunton to recognize awarding of a new $3 million state development grant. "The grant represents a partnership between Kopin and the Commonwealth of Massachusetts to create jobs and maintain Massachusetts as a leader in high-tech manufacturing," said Dr. John C.C. Fan, Kopin president and CEO. "This grant is a continuation of our strategy which includes federal, state and Kopin resources and revenues to develop leading-edge display products for use in consumer and military applications.”

The company said that the grant will be used for the facility expansion including: the construction of clean room facilities, infrastructure improvements, and implementation of a job training program. Kopin said it expects to increase the number of employees over the next five years and beyond. The company plans to complete the expansion project later this year. Company News Release

RFMD and Sirenza Sign Definitive Merger Agreement

August 13, 2007...As anticipated, RF Micro Devices (RFMD), and Sirenza Microdevices have signed a definitive merger agreement. The boards of both companies, RFMD, a dominant company in the realm of RF and wireless components and Sirenza, a supplier of RF components also, have approved the merger. Under the terms of the agreement, each outstanding share of Sirenza's common stock will be exchanged for a combination of 1.7848 shares of RFMD common stock and $5.56 in cash. Additionally, RFMD will assume outstanding options to purchase Sirenza stock, and these will be converted into options to purchase RFMD stock.

Based on RFMD's closing stock price on Friday, August 10, 2007, the last trading day prior to the announcement of the transaction, the consideration is valued at $16.64 per share. This represents a 17% premium over Sirenza's closing stock price on that date. As of that the value of the offer is approximately $900 million comprised of $300 million in cash with the balance in stock. The transaction structure is intended to allow all or a portion of the consideration receivable in RFMD stock to be tax-free to Sirenza stockholders. Upon completion of the merger and all of its terms, current RFMD and Sirenza stockholders will own approximately 67 percent and 33 percent, respectively, of the combined company on a fully diluted basis. The transaction is expected to be completed in RFMD's fiscal Q3, ending December 29, 2007. The transaction is subject to approval by the stockholders of both companies as well as regulatory approval. Company News Release

Microsemi and SemiSouth to Collaborate on SiC Material and Device Fabrication
CompoundSemi News Staff

August 13, 2007...Microsemi Corporation of Irvine, California USA, a manufacturer of high performance analog mixed signal components and SemiSouth Laboratories Inc. of Starkville, Mississippi, reported that they have entered into a collaborative agreement. Under the agreement, the companies will share their expertise in the area of silicon carbide (SiC) epitaxy wafer supply as well as certain technical knowledge. Both companies have proprietary knowledge of SiC material and device fabrication.

Russell Crecraft, Microsemi Power Products Group president and general manager, stated, "We are pleased to enter into a closer working relationship with SemiSouth. Microsemi's requirements for SiC wafers will grow in the future and we expect that this agreement will help SemiSouth's talented team of engineers to continue their progress toward highly manufacturable silicon carbide epitaxy."

SemiSouth's President, Jeff Casady commented, "At SemiSouth, our long-term goals have always been to enable the SiC power device market through high-quality SiC epitaxy wafers and devices. We are excited to be able to work with Microsemi by supplying them epitaxy wafer products needed for their product goals. Microsemi has a great track record of supplying high performance power device products, and this agreement represents a great step forward for the SiC power electronics market." Microsemi News Release

Skyworks Receives Certification for Automotive and Other Industries
CompoundSemi News Staff

August 13, 2007...Skyworks Solutions Inc. of Woburn, Massachusetts USA, has received ISO/TS 16949 certification, an internationally accepted automotive quality system accreditation, which allows Skyworks to become a supplier in the automotive market. Other markets also utilize the standard. Skyworks, an analog and mixed signal semiconductor component maker, will likely have numerous applications in which it can use its components such as: wireless, keyless entry, RFID, Bluetooth capable devices, GPS, satellite radios, and climate control sensors.

"Skyworks is proud to have completed this rigorous audit process involving many facets including design, manufacturing, design validation, final test, packing and shipping," said Nien-Tsu Shen, vice president of quality at Skyworks. "The stringent certification now positions us well with multiple German, Italian, American and French automotive customers and gives us the opportunity to significantly expand our Linear Products business." Company News Release

Our news features are reported by the CompoundSemi News staff writers.
For submissions or content suggestions, you can contact us using
editor -at - compoundsemi.com
For more information and to reserve promotion space contact
Info7 -at - compoundsemi.com
or call +1 (512) 257-9888

Sponsored Links
     
Commentary & Perspective...

Bill Kroll's Formula for Forging Stronger Partnerships with Suppliers
Jo Ann McDonald, founding editor

August 15, 2007...At our Compound Semi Vision 2007 meet in June, our "emeritus" co-chair Bill Kroll, Chairman and CEO of Matheson Tri-Gas, treated Vision attendees to an excellent talk on the importance of forging stronger partnerships with suppliers. The topic is of such critical importance to our compound semi community that the essence of Bill's talk should be shared with everyone. And given that CompoundSemi News now enjoys the largest online readership/viewership in the field, that's precisely what we'll attempt to deliver in this issue of The McDonald Report.

Bill Kroll began his presentation with a look at the literature as to just what the terms "collaboration" and "partnership" actually mean, citing authors Jassawalla and Sashittal. "Collaboration is the next step beyond integration and cross functional product development. Collaboration succeeds when there is an equal stake in outcomes and when there is an absence of hidden agendas. Participants are willing to accept the difference, when the collaboration exceeds the sum of the capabilities of the individual participants.”

He then cited an IBM and EIU survey of CEOs that revealed that product, service and market innovation have become table stakes in the competitive game. As it turns out, the second most common business growth model amongst innovators is "Major Strategic Partnerships." Interestingly, according to the second definition in Webster Dictionary, collaboration means “work with others” as well as “work with the enemy.” It all comes down to technology's Grand Challenge: Financing R&D. The industry trend, as of today, is that R&D expenses far outpace revenues, a fact that is NOT sustainable. Fiscal reality is driving the semiconductor industry towards consolidation around innovation networks. As to how collaboration with suppliers relates to the overall growth of the semiconductor industry, several industry monitors report that only the independent device makers (IDM’s) have been able to increase R&D spending substantially. The equipment and materials segment (S&P, SIA & SEMI) forecasts that demand for R&D based on CMOS scaling and the need for new materials is expected to grow 20% to 30% per technology node and that there is a $7.8B “gap” between projected R&D spending and historical trends. Thus Bill posed the question: Is the III-V market too segmented?

Successful models show that equipment (OEM’s) companies have successfully contributed to the formation of consortia (Sematech, IMEC, Albany, Selete), where new concepts can be tested and proven. And as to the development of pre-competitive IP and grant rights to OEM’s, industry collaborative groups that share resources and cost work well, especially when augmented with government support, examples being CASMAT, SilkNet, and DARPA. Turning to more industry data, SEMI's CGMG (Critical Gas and Materials Group) survey, as completed in December 2005, with 31 respondents from 25 companies replying (the 25 companies represent approximately two thirds of $8 billion wafer fab materials market) showed that tool producers are leading current partnerships and that materials producers are the leading candidates for future partnerships.

Bill included some very interesting graphs charting materials candidates for partnerships, trends and strategies of USA suppliers (you'd have had to attend to get those details) underscoring that the overall successful strategy is to enhance relationships with customers and research groups. He also pointed out that as to geographic trends, that it should come as no surprise that greater China is a major target for future investment. A parallel (and unsurprising) trend is toward consolidation, which is something we're seeing in our news pages on almost a daily basis. Bill's stated challenge to materials suppliers is to deal with the fact that many of our materials suppliers are are based in the USA, Europe, and Japan whereas the developing markets are in China.

He called the this the "Decade of Materials" pointing out that CMOS scaling is reaching a fundamental physical barrier and that processes are essentially "set" and therefore it is especially difficult to integrate new materials into existing processes. Whereas players might be very willing to form partnerships, competitive issues have to be avoided. Then there's the essential dilemma. To achieve growth we need to innovate, yet we also need to keep pace with the roadmap and shorten the proverbial "time-to-market." But we also need to support growth with solid financial returns and shorten "time-to-cash." The way to be successful is to balance risk earlier with economic return by sharing risk, and the resulting rewards, early on with your partner(s).

Bill Kroll's key points for collaboration started with the most essential: integrity, trust and honesty, adding that you must have clear objectives and/or expectations that have measurable metrics. His formula for that reads: Equal Contributions = Equal Rewards. He also reminded us that any collaboration must have an agreement evolution to keep pace with the changes in the market requirements, and that the whole collaboration must be a “win-win” proposition wherein the partner choice is critical, based on symbiotic advantages.

Then there's timing and opportunity. Bill Kroll's experience (something he's had a great deal of) has proved that a partnership can happen at any stage of a product life cycle. In the early stage, a good partnership allows for the most creative approach, whereas a bad partnership results in high risk, high investment, and long time-to-cash. In middle to late stage partnerships, a good partnership is one that results in a lower investment and shorter time-to-cash, whereas a bad partnership is one where the product is already set, thus there's less chance for “true” innovation. As to opportunities, significant ones are becoming rarer, so joining forces simply makes sense and so does expanding to parallel markets to find innovative uses for existing materials.

Bill ended his presentation by pointing out that the need for enabling materials is now more profound than ever and that the III-V world rides ahead of the Semicon pack and can “show the way.” And the way to do that is to explore new partnership and business models in order to innovate and succeed. And in a shameless promo for the company he so skillfully guides, he reminded the audience of his peers that "thinkers, innovators, dreamers and doers all have one thing in common... Matheson Tri-Gas."

If you have news or views to share about the compound semiconductor, LED or solid state lighting industries
contact our Publisher, Tom Griffiths
His direct tel in Austin is +1-512-257-9888

Current & Recent Company
News Releases

All site format, content and technology copyright 2001-2011 by CompoundSemi Online, Inc.

Static links to news articles, suitable for search engines, can be found at http://www.compoundsemi.com/news/searcharchive/.