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Commentary: Gene Fitzgerald's Crystal Ball Virtually Glowed at CS Vision
 
... Famed semiconductor industry futurist, MIT Professor Eugene Fitzgerald, kicked off our annual CS Vision Executive Business Forum in Austin, Texas USA, last month in grand style. If he had actually placed a crystal ball on the podium in front of him, nobody would have been surprised. But his personal...
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Strategy Analytics Says CS Companies Need to be Flexible to Succeed
CompoundSemi News Staff

July 9, 2007...Strategy Analytics (SA) released its regular overview of the compound semiconductor industry news including microelectronics and optoelectronics materials and equipment makers. SA’s latest report explains that much of the industry is concerned with methods and strategies for manufacturing compound semiconductor products. SA’s explains that in order to manufacture with a strategy that optimizes the fab utilization, and profitability, while giving the customers what they want, companies have chosen either outsourcing or internal manufacturing strategies. Either way, intellectual property issues have kept patent lawyers busy. Some have chosen the route of cross-licensing such as the Nichia-Stanley electric deal. Others such as Philips (Royal Philips Electronics) have chosen to acquire all of the companies and technology to produce the most advanced products in a vertically integrated arrangement.

“When it comes to manufacturing, no single strategy will prevail. Companies need to develop a methodical approach that takes account of fab utilization, customer base and profitability among other factors, when considering the question of outsourcing vs. internal investment," commented Asif Anwar, GaAs service Director. “It is important to recognize and maintain your existing strengths while maintaining the flexibility to consider external solutions.”

Stephen Entwistle, VP of the Strategic Technologies Practice, added, “IP is another area where it is crucial to know your strengths and weaknesses so that partnerships are two-way relationships.” SA asserts that flexibility will be the key to success in the industry. Strategy Analytics News Release

Global Solar Energy's Thin Foldable CIGS Solar Panels Achieve Military Certification
CompoundSemi News Staff

July 9, 2007...Global Solar Energy of Tucson, Arizona USA, a maker of thin-film copper indium gallium diselenide (CIGS) solar cells, received MIL STD-810E certification from the US military. MIL STD-810E certification requires continued operation after being under water, under vibration, after being stored at extreme high or extreme low temperatures, during a fast temperature change, at high altitude, after being dropped, and while exposed to sand and dust.

“We anticipated that our P3 products would pass the tests; Global Solar Energy has been manufacturing quality solar products for several years, now we have the certification to confirm it," said Michael Gering, President of Global Solar. “To my knowledge no other flexible solar product has this military certification," added Mr. Gering. Company News Release

Norstel and ETRI/AIST to Collaborate on SiC Growth Methods
CompoundSemi News Staff

July 9, 2007...Norstel AB of Norrköping, Sweden, and the Energy Technology Research Institute (ETRI), part of the National Institute of Advanced Industrial Science and Technology (AIST) of Tsukuba, Japan, have signed a collaboration agreement for the development of silicon carbide (SiC) material manufacturing methods for semiconductor applications. In work that began in 1995, Norstel has developed High Temperature Chemical Vapor Deposition (HTCVD), its own method for growing SiC single crystal ingots. Norstel indicated that it is currently ramping production at its new facility in Sweden. The HTCVD method, which is under the supervision of Dr. Alexandre Ellison, utilizes controlled purity gases in the growth process and it has produced very high purity wafers for advanced semiconductor processing.

AIST has developed SiC growth techniques based on the sublimation method (where silicon carbide is transported from a solid source to a seed crystal) under the supervision of Dr. Shin-ichi Nishizawa during the past 7 years. AIST achieved impressive results on material quality of up to 4” diameter. In April 2007, Dr. Nishizawa joined ETRI of AIST. Norstel said that the primary purpose of the collaboration will be to optimize SiC crystal growth quality and manufacturability. Norstel News Release

Ascent Solar Gets $20 Million from Warrant Conversion; Plans 1.5 MW Pilot Production Start by Year's End
CompoundSemi News Staff

July 9, 2007...Ascent Solar, a developer of thin-film CIGS photovoltaic modules, reported that it received $20 million as a result of the conversion of Class A public warrants. The company also said it has achieved “significant pre-manufacturing milestones.” “The additional capital received as a result of the Class A public warrant conversion and our partnership with Norsk Hydro have enabled us to achieve significant milestones ahead of plan. We are currently conducting pre-manufacturing testing on our roll-to-roll rapid prototyping tools in order to baseline the PV manufacturing processes. This is in preparation for the commencement of manufacturing operations on the 1.5 megawatt (MW) pilot production plant scheduled for completion by year end,” Ascent Solar President and CEO Matthew Foster stated. “The additional capital received will support construction of the first of four 25 MW scale production lines, the first of which is planned for completion in 2009. Our pathway to the market with large volume production has been greatly enhanced and will be strengthened further once we complete qualification of our pilot production plant.”

“By processing approximately one hundred feet each week in our roll-to-roll rapid prototyping tools, we have systematically proven out the entire end-to-end manufacturing deposition process. We believe that we can achieve repeatable and controllable processes that yield excellent uniformity,” Dr. Prem Nath, Senior VP of Manufacturing, said. “We now intend to focus on deposition process optimization and the remaining module patterning and encapsulation areas as we prepare for the staged delivery of our pilot plant production tools beginning in September 2007.” Company News Release

SiGe Semiconductor Taps Former Motorola Semiconductor President for Chairman Position
CompoundSemi News Staff

July 5, 2007...SiGe Semiconductor of Ottowa, Ontario Canada, has appointed Fred Shlapak as chairman of the board. Fred Shlapak previously served as the president of Motorola Semiconductor. The company indicated that the appointment expanded the board to seven members. Shlapak retired in 2004 after a 33-year career at Motorola. Shlapak also serves on the boards of Applied Micro Circuits Corporation, Gennum Corporation, and Tundra Semiconductor Corporation.

“We are honored that Fred has joined our Board of Directors,” said SiGe Semiconductor CEO Sohail Khan. “He brings over three decades of leadership and operational experience coupled with deep knowledge of the semiconductor industry. His perspective will be invaluable as we continue to grow our market share in RF components for a broad range of wireless applications. We’re in an exciting period for the company as we leverage our experience in GPS, and WiFi to penetrate the emerging opportunity for fixed and mobile WiMax.” SiGe Semiconductor News Release

Avanex Expands Transmission Product Portfolio with Asset Acquisition
CompoundSemi News Staff

July 5, 2007...Avenex Corporation of Fremont, California USA reported that it has acquired some of assets relating to the MSA 300-pin transponder and XFP transceiver business of the Commercial Communication Product Division (CCPD) of the Essex Corporation, a subsidiary of Northrop Grumman. The CCPD design team is located in Melbourne, Florida USA. The team is focused on developing pluggable transceivers and tunable transponders. Avanex says that the acquisition accelerates its time-to-market with new transmission components to be offered in its product portfolio. Avanex said it expects to have the acquired products integrated into its product portfolio and ready for general availability by the end of this calendar year.

"This acquisition reinforces our commitment to investing in key telecommunication optical technologies to provide our telecom customers with compelling and differentiated solutions," said Jo Major, president, chairman and CEO of Avanex. "We are excited to add this design team to our expanding transmission business." Avanex News Release

Skyworks Front-End Modules in iPhone

July 5, 2007...RBC Capital Markets released a report on the roll-out of the $600 iPhone. The analysts found that the iPhone used a front end module from Skyworks Solutions Inc, an article from Wall Street Breakfasts stated. Experts estimated that the value of each module was only $2, but that the use of the modules in Apple’s iPhone is a very significant endorsement. Apple is hoping to ship some 10 million iPhones this year. However, experts suggested that other RF front-end module suppliers will likely share in the profits from the front-end module part of the product.

Aixtron Announces New MOCVD Tool Order from Arima for LED Production
CompoundSemi News Staff

July 3, 2007...Aixtron reported that Arima Optoelectronics purchased a new MOCVD tool for the production of red, yellow, and yellow/green ultra-high brightness LEDs. Arima will add the new AIX 2600G3 system set up in the 49x2” configuration to its already operational multiple Aixtron Planetary Reactor systems. Aixtron indicated that the new system will be delivered and installed soon at Arima’s facility in Taiwan.

Dr. P. J. Wang, President of Arima commented, “We once again turned to AIXTRON for the simple reason that in our experience, they have proven to be superior to all other systems available on the market. Within the past year we already ordered three AlGaInP systems which were smoothly transferred into production and are performing very satisfactorily. Therefore we ordered this new MOCVD system in exactly the same configuration.” Aixtron News Release

Philips Sells Stake in GaAs Developer, Ommic S.A.S.
CompoundSemi News Staff

July 2, 2007...Royal Philips Electronics (Philips) of Amsterdam, the Netherlands, reported that it has sold its controlling stake in Ommic S.A.S. to Financière Victoire S.A.S. of France for an undisclosed sum. Ommic develops and manufactures wafers based upon gallium arsenide technology for applications including: wireless telecom infrastructure, optical networks, and automotive mobile T.V. Philips indicated that the sale will allow the company to focus on its other technology activities in addition to its other business that deal in healthcare and lifestyle. Ommic, a company with about 75 employees will keep its headquarters in Paris, France. Philips News Release

Avago Completes Acquisition of Infineon’s Polymer Optical Fiber Business
CompoundSemi News Staff

July 3, 2007...Avago Technologies of San Jose, California USA, announced that it has closed its acquisition of Infineon Technologies AG’s Polymer Optical Fiber (POF) business based in Regensburg, Germany. Avago says that its acquisition of Infineon’s POF business doubles its investment of resources in R&D for automotive, industrial and home networking product lines, as well as in emerging markets like optical links for mobile devices. Additionally, Avago says it will continue to support and grow market share in all areas targeted by Infineon's POF group.

"This strategic acquisition is in line with Avago's goal of increasing the value of our overall business in the four key end markets we serve," said Fariba Danesh, general manager and vice president of Avago's fiber optic products division. "It opens up opportunities for Avago's other product divisions and enables us to continue a leadership role in standards development in the optics space. We are pleased to welcome the team from Regensburg to Avago." Avago News Release

MRV Communications Completes Acquisition of Fiberxon
CompoundSemi News Staff

July 2, 2007...MRV Communications of Chatsworth, California USA, and its wholly owned subsidiary, Luminent Inc., reported that MRV has closed its previously announced acquisition of Fiberxon Inc. effective July 1, 2007. Former stockholders of Fiberxon, an optoelectronics company, are reportedly entitled to cash and shares of MRV common stock. MRV said it plans to combine Luminent with Fiberxon and it will operate the combined business under a unified management team.

“We are very excited about closing the acquisition of Fiberxon, and believe that its combination with Luminent creates one of the largest, most comprehensive manufacturers of optical transceivers for telecommunications networks. The combined company is expected to be a leader in providing BPON, GPON and GE-PON transceivers for the fast growing FTTX market and will also have a strong position in supplying metro transceivers including the rapidly expanding 10-gig opportunity,” commented Noam Lotan, President and CEO of MRV. Company News Release

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Commentary & Perspective...

Gene Fitzgerald's Crystal Ball Virtually Glowed at CS Vision
Jo Ann McDonald, founding editor

July 4, 2007...Famed semiconductor industry futurist, MIT Professor Eugene Fitzgerald, kicked off our annual CS Vision Executive Business Forum in Austin, Texas USA, last month in grand style. If he had actually placed a crystal ball on the podium in front of him, nobody would have been surprised. But his personal charisma makes up for any lack of actual mystical abilities. His talk, titled "Innovation in IC’s: New Materials, New IC’s?" was an apt keynote for this unique gathering of CEOs, their lieutenants, consultants, investors, and market prognosticators.

Gene Fitzgerald is the Merton C. Flemings-SMA Chair Professor of Materials Engineering at MIT. He's kind of a rock star of the semiconductor industry, on tour seemingly constantly, brightening every arena he enters. He's also a really nice guy and we felt privileged to have him wedge CS Vision into his busy agenda. I'm not implying that I understood everything he said because much of it was over this lowly journalist's head. (I'm not a technologist, but I absolutely recognize a rock star when I see one). But after 35 years hanging around and down inside advanced semiconductor wells of expertise, correct me if I'm wrong, but I think I got the gist of his message. That being... that there's definitely a place for compound semi materials in next gen ICs, provided that they recognize their place in the established semiconductor industry pecking order.

Gene started by reminding us that the building of the overall semiconductor industry (which, as we know, is comprised of many industries) can be categorized in three phases: Phase I: Materials Selection and Vertical Integration; Phase II: Age of Scaling; and Phase III: Age of New Materials. And the latter, for Gene, is focused on what he calls sustained silicon and CS-Si CMOS. The catch phrase that caught my ears and eyes was: Creating a common platform at the lowest level (materials) produces innovation, strategic advantage, economic growth at all the before mentioned levels.

The ICs and systems of the future are definitely bounded by reality, he pointed out, citing that good old Moore’s Law (i.e. transistor density) is actually not the main overarching paradigm and that calculations/$ at the system level is a long term metric. Gene's generalization is that economical miniaturization is still the goal, and that Moore’s Law paradigm has created integrated systems based on MOSFETs that calculate at low V,I very well... but, the bottleneck is now at the digital/communication interface, which is actually outside the silicon IC world. So he poses the following to the shakers and movers of the CS industry, i.e. CS Vision attendees: "We will use silicon manufacturing because it is the lowest-cost way to make any complex patterned object." That one's no surprise. Any sensible CS company bases its business model on the premise that: If you can do your design in silicon, by all means do. It's the cheapest most sensible route to go. But if you can't... you have no choice but to look to the CS world for new materials. We all should know that mantra by now. Based on that, Gene's point is that wireless and optical interconnects/functionality, embodied within their optimal materials (CS), need to be integrated on silicon. OK. We can work with the other team. Why not? Once they recognize the compounds exist and bring something to the party, great! His questions then become: How do we do this? and... Who will do this?

Gene's answers lies in what he calls the SOLES integration scheme. SOLES stands for Silicon on Lattice-Engineered Substrate. Ah... sounds like SiGe to me. But it's more sophisticated than that. I'll not outline it here because it's been detailed in the extended trade press news and at other conferences, but suffice to say, the key appears to be that it involves coplanar integration using standard semiconductor processing, a template layer matched to GaAs buried to allow standard SOI wafer processing, and after CMOS processing, etch device Si and SiO2 is used to access a GaAs template, and then you integrate the III-V and Si devices with standard Si back-end processing. Piece of cake or "POC" (my term). It's evidently already being employed to make monolithic visible LED arrays on Si using SOLES and CMOS-compatible processing, which of course he detailed, which is when I started to see some clouds in his crystal ball, but then again, as I said, I'm not a technologist. I'm just a technology journalist. (There's a big difference.)

I did understand when he pointed out that a disaggregated industry removes the ability to innovate across the supply chain because I can spot a cool new phrase when it's throw out and "disaggregated industry" pretty well nails what we have at this point and time within the compounds. And he also noted that a huge, long term investment is required if this is to be implemented to the level of commercial profitability (like we don't always hear that) and that vertical knowledge (yet another way cool term) is required for novel new products. He also noted that commercial sustainability in small market size is possible, and that virtual vertical (man, can this guy come up with new totally cool terms) brings with it high security compared to a mature horizontal, high strategic advantage. Then he again challenged the audience with: Who Will Do this?

Given this was a heavily CEO audience, he set the tone for the rest of the two days by asking if The Who should be silicon IC companies? Heck, they have a terrible reputation for starting new markets that are too small for their now giant appetites. The decade timescales needed for implementation are beyond their patience. So how about the CS industry's IC companies? Maybe... but they might be wedded to their own infrastructure (hey... we can change... heck, we might even learn to embrace the word standards!) Gene posed that maybe here's a place for new entrants. If you're a newbie company, what Gene is proposing poses what looks to the newbie as a large market. What it will take, he challenged, is an openness to establish a relationship between the CS and the silicon industry. What a concept!

Maybe that's why we sometimes see people from the likes of Intel and AMD sneaking into our companies or executive business forums for a quiet look see. Remind me to (quietly) invite some of the leading silicon IC company strategic planners to CS Vision '08, which will be held in late January or early February (the timeframe it and its predecessor event, CS Outlook, use to be held) in some nice warm spot where you don't have to worry about flying into a snowstorm.

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