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Editorial: Gene Fitzgerald's Crystal Ball Virtually Glowed at CS Vision
 
... Famed semiconductor industry futurist, MIT Professor Eugene Fitzgerald, kicked off our annual CS Vision Executive Business Forum in Austin, Texas USA, last month in grand style. If he had actually placed a crystal ball on the podium in front of him, nobody would have been surprised. But his personal...
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Avanex Expands Transmission Product Portfolio with Asset Acquisition
CompoundSemi News Staff

July 5, 2007...Avenex Corporation of Fremont, California USA reported that it has acquired some of assets relating to the MSA 300-pin transponder and XFP transceiver business of the Commercial Communication Product Division (CCPD) of the Essex Corporation, a subsidiary of Northrop Grumman. The CCPD design team is located in Melbourne, Florida USA. The team is focused on developing pluggable transceivers and tunable transponders. Avanex says that the acquisition accelerates its time-to-market with new transmission components to be offered in its product portfolio. Avanex said it expects to have the acquired products integrated into its product portfolio and ready for general availability by the end of this calendar year.

"This acquisition reinforces our commitment to investing in key telecommunication optical technologies to provide our telecom customers with compelling and differentiated solutions," said Jo Major, president, chairman and CEO of Avanex. "We are excited to add this design team to our expanding transmission business." Avanex News Release

SiGe Semiconductor Taps Former Motorola Semiconductor President for Chairman Position
CompoundSemi News Staff

July 5, 2007...SiGe Semiconductor of Ottowa, Ontario Canada, has appointed Fred Shlapak as chairman of the board. Fred Shlapak previously served as the president of Motorola Semiconductor. The company indicated that the appointment expanded the board to seven members. Shlapak retired in 2004 after a 33-year career at Motorola. Shlapak also serves on the boards of Applied Micro Circuits Corporation, Gennum Corporation, and Tundra Semiconductor Corporation.

“We are honored that Fred has joined our Board of Directors,” said SiGe Semiconductor CEO Sohail Khan. “He brings over three decades of leadership and operational experience coupled with deep knowledge of the semiconductor industry. His perspective will be invaluable as we continue to grow our market share in RF components for a broad range of wireless applications. We’re in an exciting period for the company as we leverage our experience in GPS, and WiFi to penetrate the emerging opportunity for fixed and mobile WiMax.” SiGe Semiconductor News Release

Skyworks Front-End Modules in iPhone

July 5, 2007...RBC Capital Markets released a report on the roll-out of the $600 iPhone. The analysts found that the iPhone used a front end module from Skyworks Solutions Inc, an article from Wall Street Breakfasts stated. Experts estimated that the value of each module was only $2, but that the use of the modules in Apple’s iPhone is a very significant endorsement. Apple is hoping to ship some 10 million iPhones this year. However, experts suggested that other RF front-end module suppliers will likely share in the profits from the front-end module part of the product.

Aixtron Announces New MOCVD Tool Order from Arima for LED Production
CompoundSemi News Staff

July 3, 2007...Aixtron reported that Arima Optoelectronics purchased a new MOCVD tool for the production of red, yellow, and yellow/green ultra-high brightness LEDs. Arima will add the new AIX 2600G3 system set up in the 49x2” configuration to its already operational multiple Aixtron Planetary Reactor systems. Aixtron indicated that the new system will be delivered and installed soon at Arima’s facility in Taiwan.

Dr. P. J. Wang, President of Arima commented, “We once again turned to AIXTRON for the simple reason that in our experience, they have proven to be superior to all other systems available on the market. Within the past year we already ordered three AlGaInP systems which were smoothly transferred into production and are performing very satisfactorily. Therefore we ordered this new MOCVD system in exactly the same configuration.” Aixtron News Release

 

Avago Completes Acquisition of Infineon’s Polymer Optical Fiber Business
CompoundSemi News Staff

July 3, 2007...Avago Technologies of San Jose, California USA, announced that it has closed its acquisition of Infineon Technologies AG’s Polymer Optical Fiber (POF) business based in Regensburg, Germany. Avago says that its acquisition of Infineon’s POF business doubles its investment of resources in R&D for automotive, industrial and home networking product lines, as well as in emerging markets like optical links for mobile devices. Additionally, Avago says it will continue to support and grow market share in all areas targeted by Infineon's POF group.

"This strategic acquisition is in line with Avago's goal of increasing the value of our overall business in the four key end markets we serve," said Fariba Danesh, general manager and vice president of Avago's fiber optic products division. "It opens up opportunities for Avago's other product divisions and enables us to continue a leadership role in standards development in the optics space. We are pleased to welcome the team from Regensburg to Avago." Avago News Release

Philips Sells Stake in GaAs Developer, Ommic S.A.S.
CompoundSemi News Staff

July 2, 2007...Royal Philips Electronics (Philips) of Amsterdam, the Netherlands, reported that it has sold its controlling stake in Ommic S.A.S. to Financière Victoire S.A.S. of France for an undisclosed sum. Ommic develops and manufactures wafers based upon gallium arsenide technology for applications including: wireless telecom infrastructure, optical networks, and automotive mobile T.V. Philips indicated that the sale will allow the company to focus on its other technology activities in addition to its other business that deal in healthcare and lifestyle. Ommic, a company with about 75 employees will keep its headquarters in Paris, France. Philips News Release

MRV Communications Completes Acquisition of Fiberxon
CompoundSemi News Staff

July 2, 2007...MRV Communications of Chatsworth, California USA, and its wholly owned subsidiary, Luminent Inc., reported that MRV has closed its previously announced acquisition of Fiberxon Inc. effective July 1, 2007. Former stockholders of Fiberxon, an optoelectronics company, are reportedly entitled to cash and shares of MRV common stock. MRV said it plans to combine Luminent with Fiberxon and it will operate the combined business under a unified management team.

“We are very excited about closing the acquisition of Fiberxon, and believe that its combination with Luminent creates one of the largest, most comprehensive manufacturers of optical transceivers for telecommunications networks. The combined company is expected to be a leader in providing BPON, GPON and GE-PON transceivers for the fast growing FTTX market and will also have a strong position in supplying metro transceivers including the rapidly expanding 10-gig opportunity,” commented Noam Lotan, President and CEO of MRV. Company News Release

Photovoltaic Startup, Stion Raises $15 Million in Series B Financing
CompoundSemi News Staff

June 27, 2007...Stion Corporation (formerly NStructures), a photovoltaic startup of Menlo Park, California USA, reported that the company has raised $15 million in Series B financing. The financing round was led by LightSpeed Venture Partners. General Catalyst Partners also participated in the funding round in addition to the three existing investors, Khosla Ventures, Braemar Energy Ventures, and Moser Baer Photovoltaic.

Like others in the photovoltaic field, Stion is hoping to increase efficiency and minimize cost-of-ownership. The company said that it was not going to use CIGS or Cadmium Telluride technology. It is generally suspected that the company will utilize quantum dot technology. While this technology has shown some promise, it has not gone outside of the laboratory in terms of how practically and inexpensively it can be manufactured. Chet Farris, Stion’s president and CEO stated, “Our technology is primed for the next phase of development and the proceeds from this round will take us to early commercialization phase.” Company News Release

Anadigics PA Shipping for Samsung Smartphone

June 27, 2007...Anadigics reports that it is shipping production volumes of its AWT6223 UMTS/EDGE penta-band power amplifier (PA) module to Samsung for its SGH-I520 smartphone designed for the European market. The SGH-I520 offers many multimedia functions including: a 2.0 megapixel camera, a wide 2.3" QVGA screen allowing for the view of an entire internet page, Bluetooth capabilities, and a 50 MB internal memory along with a microSD memory card slot for up to 2 GB. The SGH-I520 handset can connect to the Internet using technology allowing the user to download content at rates up to 1.8Mb/sec over WCDMA, HSPA, or EDGE networks. The AWT6223 also has a fully functional quad-band GSM/EDGE PA, with excellent efficiency in the GSM850/900 bands and DCS/PCS bands in both GSMK and 8PSK modes.

The AWT6223 penta-band PA module that incorporates Anadigics' second-generation High-Efficiency-at-Low-Power (HELP2) technology is ideal for powering the latest handsets with multimedia functionality. Anadigics says that with the HELP2 technology the AWT6223 UMTS/EDGE penta-band PA can reduce UMTS average power consumption by up to 50 percent. This translates to significantly longer battery life for handset users. Anadigics News Release

RFMD Advances in Rankings for 2006
CompoundSemi News Staff

June 27, 2007...RF Micro Devices Inc., of Greensboro, North Carolina USA, reported that Gartner Dataquest has identified RFMD as the world’s sixth largest global wireless communications semiconductor vendor. This year RFMD advanced one position over the previous ranking in which the company was ranked seventh. From 2005 to 2006 RFMD’s revenues grew some 44 percent, a figure Gartner attributes largely to RFMD’s Polaris Total Radio RF solutions and PA module businesses. According to Gartner, in 2006, RFMD like other wireless semiconductor companies worldwide benefited from an industry-wide 75 percent increase in total wireless application revenues. Gartner indicated this industry-wide revenue increase was in part due to the growth of 3G handset demand. Gartner pointed out that 3G handsets require more semiconductor components than other handsets.

Bob Bruggeworth, president and CEO of RFMD stated, "RFMD is the leading supplier of cellular front ends across all tiers of handsets - from the high-end EDGE and 3G segments to the entry level and replacement segments of the handset market. As the cellular RF leader, we are uniquely positioned to increase our RF semiconductor content in mobile devices as 3G multimode handsets proliferate, new subscribers are added and new replacement phones are purchased.” Bruggeworth added, "Beyond handsets, the same core competencies that have supported our success in cellular are driving our opportunities in wireless LAN (WLAN), infrastructure, GPS and other complementary markets.” RFMD News Release

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Commentary & Perspective...

Gene Fitzgerald's Crystal Ball Virtually Glowed at CS Vision
Jo Ann McDonald, founding editor

July 4, 2007...Famed semiconductor industry futurist, MIT Professor Eugene Fitzgerald, kicked off our annual CS Vision Executive Business Forum in Austin, Texas USA, last month in grand style. If he had actually placed a crystal ball on the podium in front of him, nobody would have been surprised. But his personal charisma makes up for any lack of actual mystical abilities. His talk, titled "Innovation in IC’s: New Materials, New IC’s?" was an apt keynote for this unique gathering of CEOs, their lieutenants, consultants, investors, and market prognosticators.

Gene Fitzgerald is the Merton C. Flemings-SMA Chair Professor of Materials Engineering at MIT. He's kind of a rock star of the semiconductor industry, on tour seemingly constantly, brightening every arena he enters. He's also a really nice guy and we felt privileged to have him wedge CS Vision into his busy agenda. I'm not implying that I understood everything he said because much of it was over this lowly journalist's head. (I'm not a technologist, but I absolutely recognize a rock star when I see one). But after 35 years hanging around and down inside advanced semiconductor wells of expertise, correct me if I'm wrong, but I think I got the gist of his message. That being... that there's definitely a place for compound semi materials in next gen ICs, provided that they recognize their place in the established semiconductor industry pecking order.

Gene started by reminding us that the building of the overall semiconductor industry (which, as we know, is comprised of many industries) can be categorized in three phases: Phase I: Materials Selection and Vertical Integration; Phase II: Age of Scaling; and Phase III: Age of New Materials. And the latter, for Gene, is focused on what he calls sustained silicon and CS-Si CMOS. The catch phrase that caught my ears and eyes was: Creating a common platform at the lowest level (materials) produces innovation, strategic advantage, economic growth at all the before mentioned levels.

The ICs and systems of the future are definitely bounded by reality, he pointed out, citing that good old Moore’s Law (i.e. transistor density) is actually not the main overarching paradigm and that calculations/$ at the system level is a long term metric. Gene's generalization is that economical miniaturization is still the goal, and that Moore’s Law paradigm has created integrated systems based on MOSFETs that calculate at low V,I very well... but, the bottleneck is now at the digital/communication interface, which is actually outside the silicon IC world. So he poses the following to the shakers and movers of the CS industry, i.e. CS Vision attendees: "We will use silicon manufacturing because it is the lowest-cost way to make any complex patterned object." That one's no surprise. Any sensible CS company bases its business model on the premise that: If you can do your design in silicon, by all means do. It's the cheapest most sensible route to go. But if you can't... you have no choice but to look to the CS world for new materials. We all should know that mantra by now. Based on that, Gene's point is that wireless and optical interconnects/functionality, embodied within their optimal materials (CS), need to be integrated on silicon. OK. We can work with the other team. Why not? Once they recognize the compounds exist and bring something to the party, great! His questions then become: How do we do this? and... Who will do this?

Gene's answers lies in what he calls the SOLES integration scheme. SOLES stands for Silicon on Lattice-Engineered Substrate. Ah... sounds like SiGe to me. But it's more sophisticated than that. I'll not outline it here because it's been detailed in the extended trade press news and at other conferences, but suffice to say, the key appears to be that it involves coplanar integration using standard semiconductor processing, a template layer matched to GaAs buried to allow standard SOI wafer processing, and after CMOS processing, etch device Si and SiO2 is used to access a GaAs template, and then you integrate the III-V and Si devices with standard Si back-end processing. Piece of cake or "POC" (my term). It's evidently already being employed to make monolithic visible LED arrays on Si using SOLES and CMOS-compatible processing, which of course he detailed, which is when I started to see some clouds in his crystal ball, but then again, as I said, I'm not a technologist. I'm just a technology journalist. (There's a big difference.)

I did understand when he pointed out that a disaggregated industry removes the ability to innovate across the supply chain because I can spot a cool new phrase when it's throw out and "disaggregated industry" pretty well nails what we have at this point and time within the compounds. And he also noted that a huge, long term investment is required if this is to be implemented to the level of commercial profitability (like we don't always hear that) and that vertical knowledge (yet another way cool term) is required for novel new products. He also noted that commercial sustainability in small market size is possible, and that virtual vertical (man, can this guy come up with new totally cool terms) brings with it high security compared to a mature horizontal, high strategic advantage. Then he again challenged the audience with: Who Will Do this?

Given this was a heavily CEO audience, he set the tone for the rest of the two days by asking if The Who should be silicon IC companies? Heck, they have a terrible reputation for starting new markets that are too small for their now giant appetites. The decade timescales needed for implementation are beyond their patience. So how about the CS industry's IC companies? Maybe... but they might be wedded to their own infrastructure (hey... we can change... heck, we might even learn to embrace the word standards!) Gene posed that maybe here's a place for new entrants. If you're a newbie company, what Gene is proposing poses what looks to the newbie as a large market. What it will take, he challenged, is an openness to establish a relationship between the CS and the silicon industry. What a concept!

Maybe that's why we sometimes see people from the likes of Intel and AMD sneaking into our companies or executive business forums for a quiet look see. Remind me to (quietly) invite some of the leading silicon IC company strategic planners to CS Vision '08, which will be held in late January or early February (the timeframe it and its predecessor event, CS Outlook, use to be held) in some nice warm spot where you don't have to worry about flying into a snowstorm.

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