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May 29, 2007...HelioVolt, the CIGS thin film solar maker of Austin, Texas USA, has hired two
vice presidents to direct manufacturing operations. While the company expands,
Larry Peruffo will serve as vice president of supply chain and David Bown will
serve as vice president of manufacturing operations. HelioVolt hired Larry Peruffo
following his 24 years of service at Applied Materials where he most recently
served as managing director of materials. There, Mr. Peruffo helped established
dramatic manufacturing and supply chain process improvements. HelioVolt indicated
that Mr. Peruffo will help develop a global supply chain that can take advantage
of the company’s FASST manufacturing process. Previously, David Bowen
worked at Essilor Laboratories of America, an ophthalmic optics company. He
helped the company transition from research and development to large-scale production
while serving as VP of operations and technology. HelioVolt says that Mr. Bowen
will guide strategic operations as it expands product development and manufacturing
capabilities in the U.S. and abroad.
B.J. Stanberry Ph.D., HelioVolt CEO commented, “HelioVolt is now
ready to build on its core innovation – our proprietary FASST process
for rapid CIGS thin film manufacturing – to secure economies along the
entire value chain of the production process, from materials through systems-level
engineering,” He added, “The operational, manufacturing,
and global logistics acumen embodied by both Mr. Peruffo and Mr. Bowen will
be an invaluable addition to our already strong team as HelioVolt executes on
its plans for production scale-up and delivery to worldwide markets.”
Company
News Release Micromem Successfully Tests Radiation Hardness of GaAs pHEMTs
CompoundSemi News StaffMay 29, 2007...Micromem Technologies Inc., of Toronto, Canada, reported successful radiation
testing of its gallium arsenide (GaAs) pHEMT (high electron mobility transistor
structures) which were prepared to mimic the bit cell environment of the company’s
Hall Sensing MRAM. The samples were then exposed to cobalt 60 gamma radiation
in a medical device sterilization chamber. Researchers tested the samples after
the radiation exposure and found that their functioning and capabilities were
not altered at even the highest level of the tested radiation exposure. In fact,
the only radiation effects that were noted took place at temperatures below
-70 degrees Celsius. The measurements proved that the pHEMT samples made highly
sensitive Hall sensors that could function despite being dosed with high levels
of radiation. Hall sensors operate by varying their voltage output in response
to magnetic field density. Company
News Release TriQuint Makes Three MFC Family Products Available as Part of Plan to Simplify Connectivity
CompoundSemi News StaffMay 29, 2007...Radio frequency (RF) product maker, TriQuint Semiconductor of Hillsboro Oregon
USA, reports that it has made available its first three products in its Multi-Function
Circuit (MFC) family. The products, originally released in November 2006, now
come in industry standard packages. (Ref: Coverage).
According to the company this offers greater manufacturing flexibility for new
and existing customers. The new MFC products will debut at the 2007 IEEE MTT-S
International Microwave Symposium in Honolulu, Hawaii (June 5-7). The new MFCs
were made from gallium arsenide for use in point-to-point (PTP) radio, and satellite
communication applications. TriQuint has made the new products available as
part of its vision to help customers simplify next-generation connectivity.
(Ref: May
Coverage).
The devices offer frequency upconversion (amplification) in the transmit (Tx)
and local oscillator chains for digital radio and satellite communications systems
to fulfill OEM needs. “Our new MFC products embody that vision, which
includes offering more integrated devices for size and cost-constrained applications
and providing more high frequency packaged product options. Packaging gives
new and existing customers greater access to our vast portfolio of leading die-level
designs, which also ties to easier product access — the third part of
our vision for simplifying connectivity,” stated TriQuint Networks
Vice President Brian Balut. Company
News Release Microsemi Adds Most Powerful PA for PTP Wireless LAN Access Point Devices
CompoundSemi News StaffMay 29, 2007...Microsemi Corporation, an analog and mixed signal IC maker, announced that
it added its most powerful amplifier for wireless LAN access point applications.
The LX5535, the new Microsemi power amplifier manufactured with InGaP processes,
provides output power of 25dBm and extends the range of wireless LAN access
point devices utilizing the 2.4-2.5 GHz frequency range in 802.11b/g/n applications.
It is designed a two-stage monolithic microwave integrated circuit (MMIC) with
active bias and output pre-matching. It uses a single 5V power supply and has
a low forward current of 135 milliamps. It provides a power gain of 32 dB and
it comes in a 0.09mm high, 16-pin 3mm square package.
“As the demand for wireless applications continues to grow, so does
the need for ever more powerful amplifiers that can extend their range,''
said Steven G. Litchfield, Microsemi Executive Vice President and President
of the Analog Mixed Signal Group. "Our new LX5535 amplifier provides
more power, but consumes only 260 milliamps of total DC current in doing so,"
he said. Company
News Release Cree Demonstrates 100mm Zero Micropipe SiC Substrate
CompoundSemi News StaffMay 23, 2007...Cree of Durham, North Carolina USA, reported that it reached another milestone
in its development of its Zero-Micropipe silicon carbide substrate technology. SiC is a compound semiconductor material used in the production of a range of power,
light and communications components, including power-switching devices, LEDs
and RF power transistors for wireless communication. For the first time, Cree
demonstrated a 100mm (4-inch), Zero Micropipe (ZMP) n-type SiC substrate. Cree
named the SiC substrate product Zero Micropipe because it virtually eliminates
micropipes, a common crystalline defect in SiC. In a project partially funding
by the U.S. Army and the Defense Applied Research Project Agency (DARPA), Cree
was able to dramatically reduce SiC substrate defects. The latest demonstration
takes it a step further, proving that it is possible to eliminate defects in
large-area wafers also.
“Cree’s achievement of a 100-mm ZMP substrate further demonstrates
our materials technology expertise. We expect that ZMP technology can significantly
improve device yields, expand the range of products that can be designed and
produced, and enable manufacturing at higher-volume levels than had been possible
before,” stated Cengiz Balkas, Ph.D., Cree vice president and general
manager for material. Company
News Release TriQuint Introduces Network Business Unit's Vision to Simplify Connectivity
CompoundSemi News StaffMay 23, 2007...TriQuint introduced its Network Business Unit’s vision to simplify connectivity
in consumer voice, data, music, and video for fixed and mobile environments.
The company indicated that part of the simplifying of the manufacturing process
will come from the creation of gallium arsenide, surface and bulk acoustic wave
(SAW/ BAW) technologies used too integrate multiple functions into smaller,
and more efficient modules. TriQuint also reports that it is packaging more
of its catalog of gallium arsenide die-level MMICs. According to the company,
these give manufacturers surface mount amplifiers and switches. TriQuint says
that previously, die-level components were accessible primarily to manufacturers
who could handle non-packaged components. So with more packaged products, existing
and new customers will have access to a wider selection of manufacturing options.
This in turn will place products integrated with TriQuint components in new
markets. TriQuint also sought to simplify sales channels and tools used to access
company products.
“Our customers want integrated devices for size and cost-constrained
applications, more packaged product options, especially for higher frequency
applications, and a simpler way to get those products. Our vision is about anticipating
these needs and helping them increase productivity. Our customers are developing
next-generation products that will enable connectivity convergence, which is
about ‘networking’ in the human sense; it’s the ability to
work wherever a person is, staying in touch with family, playing games, sharing
pictures, having access to ‘data’ such as digital music, movies,
TV or spreadsheets, and web surfing,” said Brian Balut, TriQuint
Networks Vice President. Company
News Release SatCon Awarded Air Force SBIR Contract to Develop Generator
CompoundSemi News StaffMay 23, 2007...SatCon Technology, a maker of power electronics and power management devices
headquartered in Boston, Massachusetts USA, reported that it has been awarded
a Phase I Small Business Innovative Research (SBIR) contract with the U.S. Air
Force Research Laboratory to develop a high-speed, power dense generator for
airborne applications. The device is to produce 100 to 300 kW and should be
scalable to the MW class for directed energy weapon (DEW) power supplies.
SatCon is currently developing starter/generators, traction motors, and generators
for ground and undersea vehicles. The new generator will be designed for aerospace
applications and will be based on the company’s permanent magnet machinery
design. SatCon points out that the work expands upon the development of a 410
kW hybrid electric vehicle generator the company designed for the U.S. Army
at US Ft. Belvoir. The goal of the project is to create a generator that offers
high-speed capability, rugged design, high power density, and affordable manufacturing
capability. SatCon's President & Chief Executive Officer, David Eisenhaure,
stated, "In addition to opening up opportunities for future military
aircraft power applications, this new SatCon program further solidifies our
push into the hybrid electric vehicle sector for military, commercial, and passenger
applications. SatCon is targeting best in class solutions for the widest possible
range of hybrid electric vehicle and power conversion applications through a
broad array of developments." SatCon
News Release Emcore's New Manufacturing Facility in China Begins Shipping Products
CompoundSemi News StaffMay 23, 2007...Emcore Corporation of Albuquerque, New Mexico USA, a maker of optoelectronic
components and compound semi-based solar cells, reported that it has begun shipping
products from its new, low-cost manufacturing facility in China. The facility,
about 20 miles southeast of Beijing in the export processing zone of Langfang
City, has a 22,000 square foot, Class-10000 clean room for optoelectronic device
packaging. The company says that an additional space of about 60,000 square
feet is available for future expansion. Emcore says it will consolidate and
move the manufacturing of certain cost sensitive optoelectronic device products
to the facility. Dr. Charlie Wang, former Director of Engineering of Emcore
Fiber Optics, has been appointed General Manager of Emcore China. "We
chose this location because of its convenient access to infrastructures and
talent pools of nearby Beijing and Tianjin metro areas. This facility will experience
a very low operating cost in addition to tax and import/export benefits for
being located in an export-processing zone," said Dr. Charlie Wang.
"We will be packaging optical subassemblies for broader applications
of storage-area network, local-area network, cable TV, and telecom markets.
We have already transferred and started the qualification processes for certain
products."
"The establishment of Emcore China is an important accomplishment
as we focus on achieving our goal of profitability. Through our China operations,
we will be able to tap into a vast talent pool of low-cost skilled labor and
engineering resources. This facility, along with a strategic alignment with
our existing contract-manufacturing partners, should enable us to improve our
cost structure and gross margins across product lines within Emcore. We expect
to develop and provide improved service to our global customers using a local
presence in Asia." commented Reuben F. Richards Jr., Chief Executive
Officer of Emcore Corporation. Company
News Release Veeco Surface Profiler Shipped to PrimeStar Solar for Production Ramp
CompoundSemi News StaffMay 21, 2007...In a separate announcement, Veeco reported that PrimeStar Solar, a maker of
cadmium telluride photovoltaic modules purchased the Dektak 150 Surface Profiler.
The Dektak 150 offers increased resolution for measuring thin films to 10 nanometers
and below to meet the evolving requirements of today's photovoltaic cell applications.
"We chose Veeco's Dektak 150 stylus profiler because it has the great
combination of measurement precision, performance versatility and an attractive
price point," says Dr. Fred Seymour, PV Technology Director for PrimeStar
Solar. "This is important for us since we are aiming to quickly provide
the solar market with very low cost solar PV modules. As we continue our ramp
up for production, we will rely heavily on the Dektak to calibrate our coatings."
Veeco
News Release NSF University Centers Awarded Nanoelectronics Funding Boost
CompoundSemi News StaffMay 21, 2007...Nanoelectronics research projects at six National Science Foundation university
centers across ten United States universities will receive a total of $2 million
in funding from Semiconductor Research Corporation (SRC) and the National Science
Foundation. The joint NSF-NRI supplemental grants were awarded to teams at six
NSF centers in nanoelectronics research, along with their research leaders.
SRC indicated that the goal of the research is to advance the search for replacement
of the basic semiconductor logic structure that has served the world of computers
and integrated circuits for more than 30 years. Specifically, the researchers want to replace complimentary metal oxide semiconductor (CMOS) field effect transistors (FETs). “Without a breakthrough,
the phenomenal advances in semiconductor capabilities will slow drastically
as we reach the fundamental limits of current technology in the next decade
or so,” said Dr. Jeff Welser, director of the Nanoelectronics Research
Initiative (NRI), a research entity of SRC. (Ref: Coverage).“The IT economy has enjoyed
unprecedented growth during the microelectronics era of the past half-century.
The government and universities have quickly supported the NRI program in order
to pursue discovery of the next logic switch and continued leadership in the
new nanoelectronics era.”
Several companies are taking participating the NRI including: Advanced Micro
Devices, Inc.; Freescale Semiconductor, Inc.,; IBM Corp.; Intel Corp.; Micron
Technology, Inc.; and Texas Instruments, Inc. The companies will assign researchers
to collaborate with the university teams. NRI has the goal of demonstrating
novel computing devices and their feasibility in simple computer circuits during
the next 5-10 years. In order to reach this goal the NSF centers will work closely
with the participating companies NSF
News Release Fairchild Semiconductor Files Infringement Countersuit Against Alpha & Omega Semiconductor Ltd.
CompoundSemi News StaffMay 21, 2007...Shortly after receiving a patent infringement lawsuit from Taiwan-based Alpha
& Omega Semiconductor (AOS), power electronics company, Fairchild Semiconductor, reported
that it filed a counter suit. The counter suit alleges that AOS infringed on several
of its patents regarding the design and manufacturing of specific types of field
effect transistors (FETs). Fairchild alleges that AOS power transistor products
infringe at least four of its U.S. patents, including Nos. 6,429,481;
6,521,497;
6,710,406;
and 6,828,195.
Fairchild seeks monetary damages and an injunction to prevent AOS from selling
or importing the allegedly infringing products into the United States. On May
18 in a company news release, AOS said it had filed a complaint alleging that
Fairchild's products infringed patents AOS had purchased. (Ref: AOS
News Release). Fairchild said it has not been served with that complaint.
Fairchild said it reviewed the patents listed in the AOS’ news release
and believes those patents are either invalid or are not infringed by Fairchild's
products.
"AOS has chosen to take this dispute to the courts and we have no
choice but to respond in kind," said Izak Bencuya, executive vice
president and general manager for Fairchild's Functional Power Group. "We
intend to enforce our intellectual property rights, preferably through negotiated
license agreements, and if necessary through the courts." Fairchild
Semiconductor News Release John Peeler to Serve as Veeco CEO; Edward Braun to Step Down and Remain Chairman
Compoundsemi News StaffMay 21, 2007...Veeco ended its nearly 6-month search for a new CEO. (Ref: Coverage).The
company of Woodbury, New York USA, reported that John R. Peeler will serve as
chief executive officer, succeeding Edward H. Braun. Mr. Braun will remain chairman
of the board. The announcement follows Veeco's November 2006 announcement that
it had initiated a CEO succession search.
Mr. Peeler served as the president of the communications test and measurement
business at JDSU. This was its largest and most profitable business segment,
which earned approximately $600 million per year. Mr. Peeler reportedly brings
nearly thirty years of diversified global management expertise in growing multi-product
equipment and instrumentation technologies. Previously, Mr. Peeler was CEO of
Acterna Inc. which was acquired by JDSU in 2005. Veeco indicated that it expects
Mr. Peeler to join the company as CEO in early July. He will then be appointed
to the Veeco board within thirty days of his start date. Mr. Braun commented,
"John brings a proven track record of leadership, managing complex technology
in high growth markets. His experience will be vital in leading Veeco to new
levels of growth and profitability." Company
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