Genesis Photonics Orders Six Aixtron MOCVD SystemsFebruary 6, 2007...As part of a long-term purchase agreement, Genesis Photonics of Tainan, Taiwan,
reportedly ordered six more Thomas Swan Close Coupled Showerhead MOCVD systems
from Aixtron. A fast growing LED manufacturer, Genesis Photonics offers gallium
nitride-based LED epiwafers and chips for lighting, displays, backlights, and
automotive applications in addition to research, scientific, and industrial
applications.
Aixtron points out that as the unit price per device falls and the volume of
LEDs produced keeps increasing, LED producers rely on MOCVD tools to improve
yield and reduce costs, while producing the high quality LEDs the market demands.
Genesis Photonics produces high performance green LED chips. Genesis Photonics
acknowledges on its website: “tools to manufacturers of close tolerance
components, such as MOCVDs, are the best guarantee of our qualities.”
Terms of the purchase agreement were not disclosed, and no specific timeline
for delivery was mentioned. Aixtron
News Release IPG Photonic and Newport Reach Undisclosed SettlementFebruary 5, 2007...IPG Photonics Corporation, a maker of fiber lasers and amplifiers, and Spectra-Physics,
a subsidiary of Newport Corporation and a producer of lasers and photonics,
reported settling their patent litigation. The settlement related to a complaint
from Spectra-Physics filed in the U.S. District Court for the Northern District
of California which alleged that certain IPG Photonics’ optical fiber
and laser amplifier products infringed on Spectra-Physics patents. Terms of
the settlement agreement were not disclosed. IPG Photonics said it does not
expect the agreement to have a material impact on its financial statements or
condition. As a result of the settlement agreement, the case was dismissed with
prejudice. Newport
Corporation News Release
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February 6, 2007...Veeco of Woodbury, New York USA, reports that the California Nanosystems Institute
at the University of California, Los Angeles (UCLA) has purchased $1.7 million
of atomic force and scanning probe microscope systems (AFM/SPMs) and optical
profilers for use in the institute’s multi-user core laboratories. Veeco
said that the systems ordered during the fourth quarter of 2006 including the
"high value/low cost" Caliber SPM, a Dimension 5000 high performance
AFM, and a Wyko NT 9300 high performance Optical Profiler will be utilized in
nanoscience research. According to Veeco, the CNSI is also the first customer
to purchase its new integrated, Bioscope II Confocal AFM Package, which features
open optical and physical integration between a laser scanning confocal microscope
and an AFM. Veeco says that coupling of laser scanning capabilities with an
atomic force microscope makes the system ideal for versatile biological imaging
applications.
J. Fraser Stoddart, director of the CNSI, who holds UCLA's Fred Kavli Chair
in Nanosystems Sciences, commented, "These latest purchases further
position CNSI as one of the world's leading nanotechnology centers focused on
the advancement of cell biology, molecular and materials sciences. These tools
offer us state-of-the art 3D surface metrology and will be an important asset
to the work conducted at the Nano and Pico Characterization core facility at
CNSI to visualize surfaces and molecules, as well as nanostructures and devices,
down to the level of individual atoms." Veeco
News Release TriQuint Unveils New Product Portfolio for HandsetsFebruary 5, 2007...TriQuint has unveiled its new product portfolio which offers ultra-compact
integrated solutions for GSM / GPRS / EDGE, WCDMA and CDMA standards. The new
products will debut at the GSM World Congress in Barcelona, Spain (12-15 Feb
2007). The company’s Hadron PA Module family is an industry standard 7x7x1.1mm3
series of discrete PA modules that provide customers with a choice between EDGE-Linear
and EDGE-Polar architectures. According to the company, both the EDGE-Linear
and EDGE-polar architectures are optimized to deliver the best possible talk
time in GSM/GPRS and EDGE (8PSK) modes. TriQuint’s Hadron II PA Module
family is a new generation device that shrinks the form factor to 5x5x1.1mm3.
TriQuint says its new Tritium PA-Duplexer Module family includes versions that
support both CDMA and WCDMA/HSDPA applications with 8x5x1.5mm3 modules integrating
a duplexer and Tx interstage filter with a linear power amplifier. Each is optimized
to major global geographic frequency bands. TriQuint’s Tritium II PA-Duplexer
Module family is a also new generation, shrinking the form factor to 7x4x1.2mm3.
Like TriQuints signature GSM/GPRS transmit modules, the Quantum Tx Module family
integrates a GaAs pHEMT switch, low pass filters, and a power amplifier along
with all necessary matching/control circuits. The Quantum family now adds a
full-featured quad-band EDGE-Linear version. The Quantom familiy also provides
support of its 2007 ‘Global Handset Strategy’, a dual-band GSM/GPRS
version for emerging entry-level markets. The new Quantum II Tx Module family
adds a WEDGE compatible multi-throw switch. Quantum plus Tritium modules provide
a path to a complete, ultra-compact system solution for 3G WEDGE applications.
TriQuint pointed out that all three families of products include ESD protection
circuitry and are RoHS compliant. Company
News Release Spectrolab Solar Record Achieved with Veeco MOCVD Machine CompoundSemi News StaffFebruary 2, 2007...Veeco reported that Spectrolab’s recent world record in solar concentrator
cell conversion efficiency of 40.7 percent was made possible with Veeco’s
metal organic chemical vapor deposition (MOCVD) technology (Ref: Coverage).
According to Veeco, the record breaking solar concentrator cells were produced
using a Veeco TurboDisk As/P MOCVD system. Spectrolab, a Boeing subsidiary, used the Veeco TurboDisk machine to produce
multi-junction solar cell structure. This type of cell achieves a high level
of efficiency using and optical concentrator and a multi-junction design. Veeco
points out that the solar cells are manufactured in a single epitaxial growth
process, which requires precise control and repeatability from the MOCVD system.
Veeco
News Release
Bookham Plans Cost Reduction CompoundSemi News StaffFebruary 2, 2007...Optical component maker, Bookham Inc., reported a GAAP net loss of $21.3 million
for the second quarter of fiscal 2007 ending December 30, 2006. The company posted
a revenue decrease of about 7.2 percent compared to the same period a year ago,
but revenue remained essentially flat from the previous quarter. Revenue from
customers other than Nortel went up 58 percent higher than a year ago, but it
remained unchanged from the prior quarter. Bookham earned $14.5 million in revenue
during the quarter from Nortel. This amount was virtually unchanged from the previous
quarter. However it was down significantly from Nortel revenue a year ago of $34.3
million which included $13.8 million of last-time buy revenue, in the same quarter
a year ago.
Dr. Giorgio Anania, president and CEO of Bookham Inc said he expects revenues
from Nortel will fall during the March quarter mainly due to the completion
of the company’s guaranteed purchase agreement in December. Dr. Anania
said, “While non-Nortel revenue continues to grow, the anticipated
increase will not make up for the expected decline in Nortel sales in the March
quarter.”
Dr Anania said after the recent developments, the company is beginning a cost
reduction plan designed to save $6 to $7 million per quarter when fully implemented
starting in the September 2007 quarter. “The savings will come mainly
from reductions in our workforce, consolidation at our UK semiconductor operation,
and shifting more development activities to China,” he stated.
Dr. Anania was upbeat about the rest of the calendar year saying, “While
we have lowered our March quarter revenue forecast, I believe this will be the
low point in calendar 2007 and that revenue will rebound over the remainder
of the year. We believe that the continued strong interest and design-in activity
we are experiencing for our new products, and an expected rebound in Nortel
revenue as the inventory situation is worked through, will drive revenue recovery
over the next few quarters.” Company
Financial Results Intevac Acquires DeltaNu CompoundSemi News StaffFebruary 1, 2007...Intevac of Santa Clara, California USA, a supplier of magnetic media sputtering
equipment and low light imaging sensors, has completed the acquisition of the
assets and certain liabilities of DeltaNu, LLC of Laramie, Wyoming. DeltaNu
specializes in small footprint, handheld Raman Spectroscopy instruments.
Intevac Imaging Vice-President and General Manager Joe Pietras stated, "DeltaNu
has pioneered the development of miniaturized, high-performance Raman spectrometers.
Their unique platform provides a family of portable and easy-to-use instruments
for chemical identification in various laboratory and field applications, such
as medical diagnostics, scientific research, forensics and industrial materials
control.” He added, "We eagerly look forward to new product
opportunities that can be created by combining DeltaNu's miniature Raman spectrometer
designs with Intevac's capabilities in near-infrared sensors, which will enable
a new class of portable instruments with greatly enhanced chemical detection
capabilities." Intevac
News Release Anadigics Shipping Production Quantity WLAN 802.11n Power AmpsJanuary 31, 2007...Mainstay InGaP power amp pioneer, Anadigics of Warren, New Jersey USA is ramping
production shipment of their Wireless LAN (WLAN) power amplifiers (PAs) that
support the upcoming 802.11n multi-input, multi-output (MIMO) standard. The
company supplies several key industry players with single-band and dual-band
WLAN PAs, including the AWL6153, AWL9925, AWL9929 and AWL6951 for MIMO (802.11n)
applications. With recent announcements, MIMO applications are expected to ramp
quickly as access point and notebook manufacturers accelerate to production.
The benefits of MIMO technology include extended range beyond that of 802.11abg
and increased data rates which support simultaneous multimedia applications
such as high definition video and voice over internet protocol (VoIP). For Anadigics,
the benefits of MIMO are clear: multiple transmit chains equals multiple power
amplifiers in each MIMO device.
Underscoring the importance of this new 802 platform, Anadigics president and
CEO, Dr. Bami Bastani remarked, "We are extremely pleased by the success
of our highly integrated WLAN PAs for MIMO platforms. "The deployment of
802.11n MIMO technology expands the WLAN market with such drivers as wireless
broadband entertainment in the home. ANADIGICS' PAs and front-end ICs (FEICs)
stand out as critical enablers. We are proud to be working closely with the
leaders in the industry to develop the next generation of wireless connectivity
solutions." The new power amps are headed for applications into a broad
range of next generation home and office multimedia appliances, such as mobile
computing, CATV set-top boxes, HD televisions, and videogame console systems.
Company
news release
Laser Diode Maker Dilas Releases New High Power Near IR Conduction Cooled LDsJanuary 31, 2007...New to our company listings, but founded in 1994 in Mainz, Germany, a high power
semiconductor laser diode company named Dilas has introduced a line of near-infrared
(NIR) laser diodes emitting 60W continuous-wave (CW) power at 808 nm and 980
nm from a single 19 emitter bar. The new LDs are available in the industry-standard
(25 mm x 25 mm) conduction-cooled package, and are targeted as ideal pump sources
for solid-state lasers used for medical and industrial applications. Dilas'
808 nm and 980 nm diode lasers feature industry leading brightness, power, and
reliability. They've demonstrated an operating current of 60A and compliance
voltage of 1.7V. Beam divergence is <65 degrees by <10 degrees for 90%
enclosed power. As an added feature, Dilas will include an AR-coated aspherical
cylinder lens to collimate the fast-axis to <12 mrad, and for applications
requiring a collimated beam, our slow-axis lensing capability can further improve
bar brightness. For those unfamiliar with Dilas, the company has manufacturing
facilities in both Mainz, Germany and in Tucson, Arizona in the USA. Their website
is www.Dilas-Inc.com. Company
news release Picogiga In Pre-Production of "SopSiC" for GaN on Si DevicesJanuary 31, 2007...It's not a "popsicle" it's a "SopSiC" and that's what Picogiga
International, the Les Ulis, France-based division of Soitec, has named its
new "Smart Cut" engineered substrate for GaN-based power devices.
SopSiC stands for Silicon-on-polysilicon-carbide, and Picogiga bills the new
substrate material as a bridge between what they feel is a compound epiwafer
void between low-cost, low-power gallium nitride (GaN) on silicon and
high-cost, high-power SiC for GaN HEMT devices. According to Picogiga, SopSiC
is designed specifically to provide cost-efficient substrate solutions for advanced
high-power devices used in wireless (RF) communication systems such as radar,
satellite communications and base stations.
“SopSiC is an excellent example of how Smart Cut engineered substrates
can be used to solve challenges for III-V applications,” says Jean-Luc
Ledys, COO of Picogiga. “While GaN on both silicon and silicon carbide
is part of our existing epiwafer product line for high-power applications, SopSiC
gives our customers a significantly better performing solution than silicon—and
a considerably less expensive solution than SiC. In terms of dollar/watt, SopSiC
is an extremely attractive solution.”
The SopSiC structure is engineered using Picogiga's Smart Cut layer
transfer and bonding technology. It includes a bottom layer of polysilicon-carbide,
an insulating buried oxide layer, and a high resistivity (1-1-1) silicon top
layer, and the top layer serves as the seed layer for GaN epitaxial growth,
which is accomplished using either MBE or MOCVD epiwafer machines. The bottom
polysilicon-carbide layer is designed to evacuate the heat generated by high-power
HEMT devices. Samples for customers are now available in 3” and 4”
diameters. And because the fabrication process is not limited by the small diameters
of bulk SiC, the process is scalable to the larger wafer sizes standard for
silicon, and the company says a 6” version is currently in development.
Company
news release
Mimix Broadband Introduces MMIC SPDT Switch for BroadbandJanuary 30, 2007...Mimix Broadband, Inc of Houston, Texas USA, has introduced a gallium arsenide
(GaAs) monolithic microwave inegrated circuit (MMIC) single-pole double throw
(SPDT) switch. "This broadband switch is much smaller than comparable
FET MMICs offering similar performance," stated Amer Droubi, Product
Manager of Mimix Broadband, Inc. "Integrated backside via holes lowers
ground inductance, improving high frequency performance and simplifying assembly.
Low insertion loss, low power consumption and broadband performance make this
switch ideal for a variety of broadband applications."
The CSW0118-BD uses 0.5 micron gate length GaAs pseudomorphic high electron
mobility transistor (pHEMT) device model technology, covers the 0.5 to 18 GHz
frequency bands, and achieves 1.8 dB insertion loss and 35 dB isolation. The
device also has a P1dB of 20 dBm and 2 nsec rise/fall time. Mimix says the CSW0118-BD
is ideal for radar, communications, avionics and test/measurement applications.
The gold plated, backside reportedly makes the device compatible with either
eutectic or conductive epoxy die attach and either thermocompression or thermosonic
wire bonding. Company
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