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Editorial: Skeletons in the Closet
 
... Every 30 years or so, one simply has to clean out the storage place where one stashes all those archived compound semiconductor (CS) and solid state lighting (SSL) industry publications, conference proceedings, reports, and old correspondence from back when we actually used paper and snail mail. Better we do...
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Genesis Photonics Orders Six Aixtron MOCVD Systems

February 6, 2007...As part of a long-term purchase agreement, Genesis Photonics of Tainan, Taiwan, reportedly ordered six more Thomas Swan Close Coupled Showerhead MOCVD systems from Aixtron. A fast growing LED manufacturer, Genesis Photonics offers gallium nitride-based LED epiwafers and chips for lighting, displays, backlights, and automotive applications in addition to research, scientific, and industrial applications.

Aixtron points out that as the unit price per device falls and the volume of LEDs produced keeps increasing, LED producers rely on MOCVD tools to improve yield and reduce costs, while producing the high quality LEDs the market demands. Genesis Photonics produces high performance green LED chips. Genesis Photonics acknowledges on its website: “tools to manufacturers of close tolerance components, such as MOCVDs, are the best guarantee of our qualities.” Terms of the purchase agreement were not disclosed, and no specific timeline for delivery was mentioned. Aixtron News Release

IPG Photonic and Newport Reach Undisclosed Settlement

February 5, 2007...IPG Photonics Corporation, a maker of fiber lasers and amplifiers, and Spectra-Physics, a subsidiary of Newport Corporation and a producer of lasers and photonics, reported settling their patent litigation. The settlement related to a complaint from Spectra-Physics filed in the U.S. District Court for the Northern District of California which alleged that certain IPG Photonics’ optical fiber and laser amplifier products infringed on Spectra-Physics patents. Terms of the settlement agreement were not disclosed. IPG Photonics said it does not expect the agreement to have a material impact on its financial statements or condition. As a result of the settlement agreement, the case was dismissed with prejudice. Newport Corporation News Release

Veeco Gets $1.7 Million Order from California NanoSystems Institute at UCLA
CompoundSemi News Staff

February 6, 2007...Veeco of Woodbury, New York USA, reports that the California Nanosystems Institute at the University of California, Los Angeles (UCLA) has purchased $1.7 million of atomic force and scanning probe microscope systems (AFM/SPMs) and optical profilers for use in the institute’s multi-user core laboratories. Veeco said that the systems ordered during the fourth quarter of 2006 including the "high value/low cost" Caliber SPM, a Dimension 5000 high performance AFM, and a Wyko NT 9300 high performance Optical Profiler will be utilized in nanoscience research. According to Veeco, the CNSI is also the first customer to purchase its new integrated, Bioscope II Confocal AFM Package, which features open optical and physical integration between a laser scanning confocal microscope and an AFM. Veeco says that coupling of laser scanning capabilities with an atomic force microscope makes the system ideal for versatile biological imaging applications.

J. Fraser Stoddart, director of the CNSI, who holds UCLA's Fred Kavli Chair in Nanosystems Sciences, commented, "These latest purchases further position CNSI as one of the world's leading nanotechnology centers focused on the advancement of cell biology, molecular and materials sciences. These tools offer us state-of-the art 3D surface metrology and will be an important asset to the work conducted at the Nano and Pico Characterization core facility at CNSI to visualize surfaces and molecules, as well as nanostructures and devices, down to the level of individual atoms." Veeco News Release

TriQuint Unveils New Product Portfolio for Handsets

February 5, 2007...TriQuint has unveiled its new product portfolio which offers ultra-compact integrated solutions for GSM / GPRS / EDGE, WCDMA and CDMA standards. The new products will debut at the GSM World Congress in Barcelona, Spain (12-15 Feb 2007). The company’s Hadron PA Module family is an industry standard 7x7x1.1mm3 series of discrete PA modules that provide customers with a choice between EDGE-Linear and EDGE-Polar architectures. According to the company, both the EDGE-Linear and EDGE-polar architectures are optimized to deliver the best possible talk time in GSM/GPRS and EDGE (8PSK) modes. TriQuint’s Hadron II PA Module family is a new generation device that shrinks the form factor to 5x5x1.1mm3.

TriQuint says its new Tritium PA-Duplexer Module family includes versions that support both CDMA and WCDMA/HSDPA applications with 8x5x1.5mm3 modules integrating a duplexer and Tx interstage filter with a linear power amplifier. Each is optimized to major global geographic frequency bands. TriQuint’s Tritium II PA-Duplexer Module family is a also new generation, shrinking the form factor to 7x4x1.2mm3. Like TriQuints signature GSM/GPRS transmit modules, the Quantum Tx Module family integrates a GaAs pHEMT switch, low pass filters, and a power amplifier along with all necessary matching/control circuits. The Quantum family now adds a full-featured quad-band EDGE-Linear version. The Quantom familiy also provides support of its 2007 ‘Global Handset Strategy’, a dual-band GSM/GPRS version for emerging entry-level markets. The new Quantum II Tx Module family adds a WEDGE compatible multi-throw switch. Quantum plus Tritium modules provide a path to a complete, ultra-compact system solution for 3G WEDGE applications. TriQuint pointed out that all three families of products include ESD protection circuitry and are RoHS compliant. Company News Release

 

Spectrolab Solar Record Achieved with Veeco MOCVD Machine
CompoundSemi News Staff

February 2, 2007...Veeco reported that Spectrolab’s recent world record in solar concentrator cell conversion efficiency of 40.7 percent was made possible with Veeco’s metal organic chemical vapor deposition (MOCVD) technology (Ref: Coverage). According to Veeco, the record breaking solar concentrator cells were produced using a Veeco TurboDisk As/P MOCVD system. Spectrolab, a Boeing subsidiary, used the Veeco TurboDisk machine to produce multi-junction solar cell structure. This type of cell achieves a high level of efficiency using and optical concentrator and a multi-junction design. Veeco points out that the solar cells are manufactured in a single epitaxial growth process, which requires precise control and repeatability from the MOCVD system. Veeco News Release

Bookham Plans Cost Reduction
CompoundSemi News Staff

February 2, 2007...Optical component maker, Bookham Inc., reported a GAAP net loss of $21.3 million for the second quarter of fiscal 2007 ending December 30, 2006. The company posted a revenue decrease of about 7.2 percent compared to the same period a year ago, but revenue remained essentially flat from the previous quarter. Revenue from customers other than Nortel went up 58 percent higher than a year ago, but it remained unchanged from the prior quarter. Bookham earned $14.5 million in revenue during the quarter from Nortel. This amount was virtually unchanged from the previous quarter. However it was down significantly from Nortel revenue a year ago of $34.3 million which included $13.8 million of last-time buy revenue, in the same quarter a year ago.

Dr. Giorgio Anania, president and CEO of Bookham Inc said he expects revenues from Nortel will fall during the March quarter mainly due to the completion of the company’s guaranteed purchase agreement in December. Dr. Anania said, “While non-Nortel revenue continues to grow, the anticipated increase will not make up for the expected decline in Nortel sales in the March quarter.”

Dr Anania said after the recent developments, the company is beginning a cost reduction plan designed to save $6 to $7 million per quarter when fully implemented starting in the September 2007 quarter. “The savings will come mainly from reductions in our workforce, consolidation at our UK semiconductor operation, and shifting more development activities to China,” he stated.

Dr. Anania was upbeat about the rest of the calendar year saying, “While we have lowered our March quarter revenue forecast, I believe this will be the low point in calendar 2007 and that revenue will rebound over the remainder of the year. We believe that the continued strong interest and design-in activity we are experiencing for our new products, and an expected rebound in Nortel revenue as the inventory situation is worked through, will drive revenue recovery over the next few quarters.” Company Financial Results

Intevac Acquires DeltaNu
CompoundSemi News Staff

February 1, 2007...Intevac of Santa Clara, California USA, a supplier of magnetic media sputtering equipment and low light imaging sensors, has completed the acquisition of the assets and certain liabilities of DeltaNu, LLC of Laramie, Wyoming. DeltaNu specializes in small footprint, handheld Raman Spectroscopy instruments.

Intevac Imaging Vice-President and General Manager Joe Pietras stated, "DeltaNu has pioneered the development of miniaturized, high-performance Raman spectrometers. Their unique platform provides a family of portable and easy-to-use instruments for chemical identification in various laboratory and field applications, such as medical diagnostics, scientific research, forensics and industrial materials control.” He added, "We eagerly look forward to new product opportunities that can be created by combining DeltaNu's miniature Raman spectrometer designs with Intevac's capabilities in near-infrared sensors, which will enable a new class of portable instruments with greatly enhanced chemical detection capabilities." Intevac News Release

Anadigics Shipping Production Quantity WLAN 802.11n Power Amps

January 31, 2007...Mainstay InGaP power amp pioneer, Anadigics of Warren, New Jersey USA is ramping production shipment of their Wireless LAN (WLAN) power amplifiers (PAs) that support the upcoming 802.11n multi-input, multi-output (MIMO) standard. The company supplies several key industry players with single-band and dual-band WLAN PAs, including the AWL6153, AWL9925, AWL9929 and AWL6951 for MIMO (802.11n) applications. With recent announcements, MIMO applications are expected to ramp quickly as access point and notebook manufacturers accelerate to production. The benefits of MIMO technology include extended range beyond that of 802.11abg and increased data rates which support simultaneous multimedia applications such as high definition video and voice over internet protocol (VoIP). For Anadigics, the benefits of MIMO are clear: multiple transmit chains equals multiple power amplifiers in each MIMO device.

Underscoring the importance of this new 802 platform, Anadigics president and CEO, Dr. Bami Bastani remarked, "We are extremely pleased by the success of our highly integrated WLAN PAs for MIMO platforms. "The deployment of 802.11n MIMO technology expands the WLAN market with such drivers as wireless broadband entertainment in the home. ANADIGICS' PAs and front-end ICs (FEICs) stand out as critical enablers. We are proud to be working closely with the leaders in the industry to develop the next generation of wireless connectivity solutions." The new power amps are headed for applications into a broad range of next generation home and office multimedia appliances, such as mobile computing, CATV set-top boxes, HD televisions, and videogame console systems. Company news release

Laser Diode Maker Dilas Releases New High Power Near IR Conduction Cooled LDs

January 31, 2007...New to our company listings, but founded in 1994 in Mainz, Germany, a high power semiconductor laser diode company named Dilas has introduced a line of near-infrared (NIR) laser diodes emitting 60W continuous-wave (CW) power at 808 nm and 980 nm from a single 19 emitter bar. The new LDs are available in the industry-standard (25 mm x 25 mm) conduction-cooled package, and are targeted as ideal pump sources for solid-state lasers used for medical and industrial applications. Dilas' 808 nm and 980 nm diode lasers feature industry leading brightness, power, and reliability. They've demonstrated an operating current of 60A and compliance voltage of 1.7V. Beam divergence is <65 degrees by <10 degrees for 90% enclosed power. As an added feature, Dilas will include an AR-coated aspherical cylinder lens to collimate the fast-axis to <12 mrad, and for applications requiring a collimated beam, our slow-axis lensing capability can further improve bar brightness. For those unfamiliar with Dilas, the company has manufacturing facilities in both Mainz, Germany and in Tucson, Arizona in the USA. Their website is www.Dilas-Inc.com. Company news release

Picogiga In Pre-Production of "SopSiC" for GaN on Si Devices

January 31, 2007...It's not a "popsicle" it's a "SopSiC" and that's what Picogiga International, the Les Ulis, France-based division of Soitec, has named its new "Smart Cut" engineered substrate for GaN-based power devices. SopSiC stands for Silicon-on-polysilicon-carbide, and Picogiga bills the new substrate material as a bridge between what they feel is a compound epiwafer void between low-cost, low-power gallium nitride (GaN) on silicon and high-cost, high-power SiC for GaN HEMT devices. According to Picogiga, SopSiC is designed specifically to provide cost-efficient substrate solutions for advanced high-power devices used in wireless (RF) communication systems such as radar, satellite communications and base stations.

SopSiC is an excellent example of how Smart Cut engineered substrates can be used to solve challenges for III-V applications,” says Jean-Luc Ledys, COO of Picogiga. “While GaN on both silicon and silicon carbide is part of our existing epiwafer product line for high-power applications, SopSiC gives our customers a significantly better performing solution than silicon—and a considerably less expensive solution than SiC. In terms of dollar/watt, SopSiC is an extremely attractive solution.”

The SopSiC structure is engineered using Picogiga's Smart Cut layer transfer and bonding technology. It includes a bottom layer of polysilicon-carbide, an insulating buried oxide layer, and a high resistivity (1-1-1) silicon top layer, and the top layer serves as the seed layer for GaN epitaxial growth, which is accomplished using either MBE or MOCVD epiwafer machines. The bottom polysilicon-carbide layer is designed to evacuate the heat generated by high-power HEMT devices. Samples for customers are now available in 3” and 4” diameters. And because the fabrication process is not limited by the small diameters of bulk SiC, the process is scalable to the larger wafer sizes standard for silicon, and the company says a 6” version is currently in development. Company news release

Mimix Broadband Introduces MMIC SPDT Switch for Broadband

January 30, 2007...Mimix Broadband, Inc of Houston, Texas USA, has introduced a gallium arsenide (GaAs) monolithic microwave inegrated circuit (MMIC) single-pole double throw (SPDT) switch. "This broadband switch is much smaller than comparable FET MMICs offering similar performance," stated Amer Droubi, Product Manager of Mimix Broadband, Inc. "Integrated backside via holes lowers ground inductance, improving high frequency performance and simplifying assembly. Low insertion loss, low power consumption and broadband performance make this switch ideal for a variety of broadband applications."

The CSW0118-BD uses 0.5 micron gate length GaAs pseudomorphic high electron mobility transistor (pHEMT) device model technology, covers the 0.5 to 18 GHz frequency bands, and achieves 1.8 dB insertion loss and 35 dB isolation. The device also has a P1dB of 20 dBm and 2 nsec rise/fall time. Mimix says the CSW0118-BD is ideal for radar, communications, avionics and test/measurement applications. The gold plated, backside reportedly makes the device compatible with either eutectic or conductive epoxy die attach and either thermocompression or thermosonic wire bonding. Company News Release

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Commentary & Perspective...

Skeletons in the Closet
Jo Ann McDonald

February 7, 2007...Every 30 years or so, one simply has to clean out the storage place where one stashes all those archived compound semiconductor (CS) and solid state lighting (SSL) industry publications, conference proceedings, reports, and old correspondence from back when we actually used paper and snail mail. Better we do the sorting ourselves than leave the task to clueless descendants. But when tackling the task, one is faced with the questions: What to keep and what to throw away... and why?

Until this last weekend, my storage area for "industry collectibles" was starting to look like the classic closet in the old radio show, "Fibber McGee and Molly." If you're old enough to remember that show, and if you too have pack rat tendencies, you probably have a closet that looks much like mine did. 17 huge feed sacks later (we ranchers accumulate lots of empty livestock feed sacks) all marked to go to either the appropriate recycle bins in town or to the local landfill, that closet is now suitable to house almost anything. In my case, ranch jackets, seasonal decorations, family memorabilia and the compound semi industry "collectibles" I simply couldn't part with. I can even find office supplies in there now! I know you're not interested in the personal items (if you are, you need to get a life of your own), but I thought you might be interested in what I simply couldn't part with from my 30+ years covering the compounds as a trade press reporter and editor, and the trends I unveiled looking back through the decades.

Lugging the loads of throwaways out of the house and queuing magazines up for recyclers, I was first reminded that the old print trade publications from the last 20 years, most of which emanated from the UK, were tremendously heavy. In physical weight and in content. I swear, British paper, as used for trade magazines, outweighs USA-produced mags by a ton. Slick and glossy, they were all especially hard to throw away, if only because so many lovely trees obviously gave their lives for the cause of the advancing the compounds. I hope the recyclers pay a bit of reverence to them as the pulp gets recycled into... whatever.

After thumbing through them as they went in the sacks--and given I was finally in a throwaway mood-- the only magazine issues I egotistically elected to keep were the remaining existing issues of the original III-V Technology Review magazine, which I myself originated, wrote and published in 1986 and 1987... long before any of the subsequent compound semi-related print publications even existed. It was even easy to throw out all those issues of magazines in which I contributed articles, because I've long gotten over the thrill of seeing my byline. But I couldn't possibly part with my own creations. Not that I'm ever going to read the contents again, but they still show well on a coffee table.

I haven't touched nor looked at those five vintage issues for years. If you weren't playing in compound semi circles in the mid-1980s and never saw them, we selected really sexy covers, each depicting speed (a falcon, a race car, a jet, etc.) honoring GaAs's speed v.s. silicon's. The only writing on the cover, besides the title and year, said... "a quarterly journal covering current views and research updates for the GaAs/III-V based high speed analog, MMIC and digital IC community." (Whew, that was a mouthful!) We obviously had a long way to go to define our industry distinctly and succinctly back in the Original '80s. HB-LEDs and the notion of solid state lighting (SSL) weren't even a glint in our collective eyes back then. And we hadn't yet clicked on the easier handle of compound semiconductors let lone, the simplified, compound semi. The latter term was the stroke of genius of our publisher, Tom Griffiths.

The other generic thing I kept were my master tapes from telephone interviews in the '80s and '90s. Not being a technical person, with the interviewees permission (of course), I taped everything simply so that I'd get the story right. Given the technology of the times, and given I've always been a fast typist, I laboriously transcribed every word you guys said, printed the transcripts out, highlighted the usable quotes and explanations, then wrote my story. As computers improved and email entered the scheme, the amount of paper diminished significantly. Online communication and "cut and paste" (and don't you love that kindergarten term) has totally outmoded taping. One of the things left in the closet is my last desktop computer, before upgrading to a laptop, because it may have something important stored on it.

I also kept every bit of videotape I ever spent on you guys. Scroll down our CompoundSemi Online homepage left hand menu to the part that asks New to the Compounds? to our old videotape 101 workshops. Those were first-class industry video productions, leveraging my earlier career as a business network television producer. Nitride 101 from 1999 was when Shuji Nakamura was in his final year at Nichia. If Shuji ever wins a Nobel, I've got some very key original footage. And the GaN 101 video from 2001 is another classic because it featured some of the great international wide bandgap pioneers. InP 101 would be interesting because it would likely reveal, in retrospect, why InP wasn't destined to be as great as people hoped it would be. Like InP 101 workshop leader (and InP guru) HRL's Joe Jensen pointed out, "I can grow the world's whole supply of InP devices on my one machine." There was actually that little demand for it. I wouldn't be surprised if that's still the case! In any case, I've hung on to a slew of workshop tapes and all the original footage and masters. You never know when The History Channel might call...

Back when we held the original BLUE 2003 event in Dallas, I hauled a bunch of the old magazines and interesting memorabilia to the conference to share with other nostalgia buffs. That was my first clue that nobody really cared much about what happened way back when. Except for the Cree guys getting excited that I still had some old souvenir T-shirts and jackets from events back when Cree had so much money they threw stupendous parties. I kept the apparel, but finally threw out the old dog-eared proceedings and huge binders. Why do we insist on heavy print proceedings? They never fit easily into your luggage. A DVD of the presentations or promise that they'll be available to attendees online within a week makes way more sense. Give the trees a break!

So as I look at my nice clean closet, I say goodbye to quite a few old skeletons. We haven't yet hauled the bags to the landfill, but I doubt I'll shed a tear. It's time to bid the past farewell and move on to the future, which is why organizing CS Vision 2007 is such a joy. One of the most important trends I saw, felt, and believed as I did the closet sort was how all those dreams I had in the 1960s have actually come true. Thanks to the decades of advancement in the semiconductor industry, we're on the verge of finally becoming the paperless society computer and semiconductor pioneers envisioned. The CS and SSL industries are obviously taking the lead in energy and resource conservation. All of who work in or support the CS and SSL industries are helping make incredible strides toward reversing the trend of unmanageable waste and environmental clutter. It's what we preached in the '60s, and then went about offering solid, sensible energy saving solutions, like smaller, smarter systems, solid state lighting and higher efficiency solar cells.

If you have news or views to share about the compound semiconductor, LED or solid state lighting industries
contact our Publisher, Tom Griffiths
His direct tel in Austin is +1-512-257-9888

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