Japan Getting Pro-Active to Prevent Patent Outflow

April 11, 2004...Since we're beginning to hear more about patent litigation issues once again, especially as they related to the blue spectrum LEDs, it's interesting to see that more Japanese firms in general, and outside that sector, are resorting to suits to do what they can to "stem the technology drain" that appears to be currently underway. That's the theme of an article which appeared in the Nihon Keizai Shimbun April 7 morning edition. In it, the reporters track lawsuits filed recently by Fujitsu Ltd. against South Korea's Samsung SDI Co. alleging patent infringement on technology for plasma display panels, but what's happening isn't exclusive to PDPs, as you can see by our editorial, this issue, where patent attorney Steve Smith comments on Nichia's recent white LED related patent statement. The indications, says the Japanese news source, is that Japanese firms are increasingly invoking patent rights to prevent the outflow of their state-of-the-art technologies.

A follow-up article was posted on April 8th morning edition titled Japan Firms Strengthen Resolve to Tackle Infringement. Thus, it looks like other Japanese companies are ready to enter legal battles to protect their patents. Behind their toughening stance are the rapid technological innovations being achieved by South Korean and Taiwanese rivals, in this case, Samsung Electronics Co. of South Korea. SEC became the largest shareholder in the global DRAM market about a decade after entering the arena in 1983. It grabbed the top position in the global thin-film-transistor liquid crystal display market six to seven years after moving into the market in 1995, according to Nihon Keizai Shimbun April 8 morning edition, where it was also reported that, in addition to Fujitsu's suit against Samsung, the actions of the companies involved are expected to have a major impact on the global PDP market, which is projected to expand to 1 trillion yen in three to four years. So far, neither firm has shown any willingness to seek an out-of-court settlement.

What? RFMD Worry?

April 11, 2004...If you wonder if our industry takes a hit when one of the major wireless phone makers predicts lowered expectation (most recently, Nokia), just take a look and see what RF Micro Devices is seeing. On April 6th and 8th, RFMD of Greensboro, North Carolina USA seemed to think things are going pretty well. Consistent with their webcast to financial followers on March 9th, RFMD still anticipates their Q-1 revenue will be at the high end of the range of approximately $152 million to $163 million. We'll know more when RFMD and their competitors report quarterly earnings throughout April. RFMD also reported that the reason they're doing well, is that they've Increased shipments to Samsung Electronics, which is currently the #3 cellphone major, behind Motorola and Nokia, and evidently making it known they intend to move up in the rankings asap.

RFMD is shipping high-volumes of their RF3146 third-generation PowerStar power amplifier (PA) module to Samsung Electronics. RFMD supplies PowerStar PAs into approximately 70 percent of Samsung's GPRS handsets. Based on existing design wins across more than 30 GPRS handsets, RFMD expects to increase its GSM/GPRS PA market share at Samsung this year. Additionally, the Company anticipates incremental revenue opportunities at Samsung in 2004 in cellular transceivers and in CDMA power amplifiers. Joe Grzyb, general manager of power amplifier products at RF Micro Devices, said, "We are pleased to extend our relationship with Samsung to include our RF3146 PowerStar power amplifier modules. Samsung is a global leader in cellular handsets, and we look forward to supplying additional PA components in their future generations of handsets." Details are on the RFMD news release.

Spectrolab's Solar Cells Score Space Tech Hall of Fame

April 11, 2004...Yes, there is a "Hall of Fame" for companies working in space technology, and Boeing's Spectrolab unit was recently inducted into it for their high efficiency multijunction solar cell work. It's called the Space Technology Hall of Fame, which is sponsored by the U.S. Space Foundation, and the distinction was bestowed upon Spectrolab at the National Space Symposium. Four Spectrolab associates – Bruce T. Cavicchi, James Ermer, Dr. Nasser H. Karam and Dr. Richard R. King– were honored at the recent Space Technology Hall of Fame dinner in Colorado Springs, Colorado USA. Also honored were representatives of the USA's Air Force Research Laboratory (AFRL) for sponsoring research and development in this particular, and critical technology area. Spectrolab is a wholly owned subsidiary of Boeing Satellite Systems and considered a leading manufacturer of space-qualified multijunction solar cells and panels. Their latest solar cells now in production, called the Ultra Triple Junction cells, feature Spectrolab’s third-generation triple junction design that convert more than 28 percent of the sunlight reaching them into electricity.

“This award is a fitting and well deserved tribute to the Spectrolab team. Spectrolab solar cells and panels have provided reliable power for many decades to all our satellite models, and have enabled satellite power growth across the industry in recent years,” said David Ryan, vice president and general manager of Boeing Satellite Systems. Also at the awards, Dr. David Lillington, president of Spectrolab, praised his colleagues for dedication to continuous improvement in the quality, reliability and performance of space solar panels. He also thanked the Air Force for supporting Spectrolab’s efforts to develop this technology. Spectrolab triple junction solar cells are currently powering numerous commercial and government satellites, including Galaxy IIIC, a Boeing 702 satellite that is one of the world’s most powerful satellites ever launched into space. Company news release

Intel Leads the Way Getting the Lead Out

April 11, 2004...Environmental activism within the semiconductor industry is always good news, and at the recent Intel Developers Forum in Tokyo, Japan, Intel let it be known that all should follow their lead when it comes to literally "getting the lead out." At the Forum, Intel Corporation announced it will begin eliminating an impressive 95% of the lead used in its processors and chipsets starting later this year and they specifically noted that they're taking these significant steps to remove lead from its product packaging in order to make it more environmentally friendly. The company shipped its first lead-free memory chips last year and said it will begin shipping the lead-free technology with select microprocessors and chipsets in Q3, 2004, and embedded IA processors in Q2, 2004. Furthermore, additional Intel products will be transitioned as manufacturers become able to handle them.

The new Intel packages use lead-free solder balls, about the size of salt crystals, and represent the majority of lead used in Intel microprocessor packaging. Intel is working with the industry to find a reliable solution for the tiny amount of lead still needed inside the processor packaging to connect the actual silicon "core" to the package. The transition to lead-free is a massive industry-wide effort with many technological, logistical and economic challenges. Since 2000, Intel has been working with industry consortia and the European Union's Restriction of Hazardous Substances (RoHS) legislation committee to come up with a solution that can be used around the world. Helpful details for those who need to learn more about how to also reduce the lead in their products can be found in the Intel company news release.

Anadigics Introduces New One Watt InGaP HBT Power Amp

April 11, 2004...Anadigics Inc. of Warren, New Jersey USA has expanded its line of wireless infrastructure products with the introduction of a one watt InGaP HBT amplifier which addresses medium power basestation applications by providing adjacent channel power rejection (ACPR) of greater than 70 dBc, while meeting the demanding reliability requirements of the wireless infrastructure market. The new product is called the ADR3410 and was designed in cooperation with a leading cellular basestation equipment manufacturer and optimized the amplifier to deliver high performance for a WCDMA signal over the wireless frequency bands of 850 to 2200 MHz. "This new one watt amplifier is the first in a new family of products at ANADIGICS that expands our served available market in wireless infrastructure by serving the requirements of medium power basestation applications," said Ron Michels, VP of Broadband Products at Anadigics. "We developed the ADR3410 to answer our customers requirements for greater performance at higher output power and the feedback we received verifies that we have introduced a market leading product. Building on our growing portfolio of best of breed InGaP HBT amplifiers, this product delivers the performance and reliability desired by wireless network carriers to enable enhanced 3G services." The ADR3410 is priced at $5.05 in quantities of 1,000 units. Samples are available. Company news release

Our news features are reported by the CompoundSemi News staff writers.
For submissions or content suggestions, you can contact us using
editor -at - compoundsemi.com
For more information and to reserve promotion space contact
Info7 -at - compoundsemi.com
or call +1 (512) 257-9888

The McDonald Report
Commentary & Perspective...

Japan, China and South Korea Teaming on Emerging Technologies

If you have questions about the solid state lighting and compound semiconductor industries or have news or views to share, I'm Jo Ann McDonald, Editor of LIGHTimes and CompoundSemi News.
Feel free to contact me directly, anytime.
My direct tel at the ranch is
+1-325-463-5345

From time to time Jo Ann may comment on companies in which she holds a modest investment - be sure to read her disclosure at some point in time...