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Commentary: Taiwan's the Hot Spot for Blue 2004 in May
 
... With the success of Blue 2003 last summer in Dallas, we had to ask, where should we hold the 2004 follow-on? Given the recent IP news and the incredible buildup of MOCVD GaN tools in Asia, especially in Taiwan, obviously that country becomes the hot spot for the production...
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Nichia Puts More Pressure on Taiwan Blue Spectrum LED Community

October 30, 2003...Litigation pressures continue to mount in Taiwan following Nichia's initial tussles with Epistar. Moving on up the next rung of the supply chain, Nichia is now making it known to contract manufacturers making use of the GaN-based products in question that they too will be held accountable. Nichia was just granted a preliminary injunction order against Everlight, a large Taiwanese GaN LED assembly manufacturer that uses Epistar GaN products. Everlight is generally regarded as a "sister company" to Epistar. The specific Everlight products Nichia is targeting carry the part numbers ES-CEBH712:A3 and ES-CEBH712:A4 which supposedly infringe on Nichia's Taiwan patent No. 160,722. While the injunction does not specifically cite an Epistar product, consensus of technical people in the field is that this is indeed targeted at Epistar. According to the Nichia announcement, the preliminary injunction order may prevent Everlight from using the accused products, and states that Nichia is currently evaluating whether to enforce the preliminary injunction order, and whether to further legal actions against other assembly manufacturers that use products infringing Nichia's patent(s). General reaction from financial analysts in the USA is that this could bode well for that country's domestic suppliers of blue spectrum LED die and packaged devices, the leaders of whom are Lumileds and Cree. The dramatic buildup of Asian suppliers has significantly pressured pricing of GaN LED epiwafers and devices. Compound semi industry market researcher, Robert Steele of Strategies Unlimited, who is a specialist in advanced LEDs and especially GaN-related markets, commented on Nichia's latest move saying, "This appears to be a 'warning shot across the bow' that Nichia is willing to move up the supply chain in order to enforce its patent position. By our estimate, in addition to Epistar, there are at least 15 additional providers of GaN chips in Taiwan, and as many as 25 in all of Asia, outside Japan. We don't know if Nichia will go after other chip suppliers and their customers, but Nichia appears to be setting an example with Epistar and Everlight to others that may be seen to be violating their patents." Nichia news release

Lite-On Adds Depth and Breadth with Fairchild Deals

October 30, 2003...Lite-On Technology Corporation of Taiwan, while highly diversified on the surface, turns out to be one of the biggest, if not the biggest of the Asian blue spectrum LED manufacturers, larger even than Epistar. A vertically integrated company, Lite-On is heavily involved in producing a number of handheld devices that utilize white LEDs, product developments, including advanced cellphones. The company is soon to expand on other fronts as well, having entered into equipment and supply agreements with Fairchild Semiconductor of South Portland, Maine USA. The "new Fairchild" is noted as a supplier of high performance products that optimize system power for multiple end markets. The agreements Fairchild has entered into with Lite-On includes equipment transfer and product supply agreements that will facilitate Fairchild’s previously announced plans to close their Wuxi, China and Kuala Lumpur, Malaysia manufacturing facilities. According to those agreements, Lite-On will purchase manufacturing equipment currently located in Wuxi and Kuala Lumpur from Fairchild with the equipment transferring over to Lite-On over the next six months. No other assets, including intellectual property, business agreements or products, are included in the sale of the equipment. Under a separate product supply agreement, Lite-On will manufacture components currently made at the two sites for Fairchild – specifically infrared devices, optocouplers and displays. Fairchild noted it will continue to meet its customers’ needs for these products through its current sales channels while also noting that further terms of the agreements, such as a price paid by Lite-On for the Fairchild equipment, have not been disclosed. Company news release

Spire Scores Aluminum Oxide Substrate Implant Patent

October 30, 2003...Spire Corporation of Bedford, Massachusetts USA continues to make its renewed presence in the compound semi industry known, with the intent of once again becoming a key contributor to state of the art substrate development. On October 21, Spire officially received word they had received a key USA patent on a method for implanting aluminum oxide in GaAs and "other" group III and V semiconductor wafers for the isolation of integrated circuit lasers and optical waveguides. U.S. Patent No. 6,635,559 is titled Formation of Insulating Aluminum Oxide in Semiconductor Substrates, and describes a process whereby aluminum oxide can be selectively formed in the top layers of III-V compound semiconductor wafer structures to ensure electrical isolation between devices in integrated circuits. Thesis is that, because of a lack of good quality native oxide insulators in III-V compound semiconductor materials, complete device isolation is deemed difficult. Therefore, Spire's method of implanting AlO provides the industry with a robust, precision-defined, physically compatible layer that can be used to provide device isolation. In addition to electrical isolation. Plus, Spire's method of solving this difficulty also has applications for optical waveguide formation. (Optical waveguides can be incorporated into monolithic optoelectronic device structures for use as waveguides, splitters, combiners, modulators, and emitters.) The patent also includes use of the method for device isolation in the lateral plane of III-V semiconductor integrated circuits as well as for incorporation of buried layers of aluminum oxide insulator material into integrated electronic and optoelectronic device structures. Target applications for the newly patented technology include wireless audio communication devices, wi-fi devices, broadband and wireless Internet and video devices, as well as future optoelectronic and photonic components and systems. Company news release

Cree Gets More Vertical with Move Into Packaging

October 28, 2003...During Cree's annual shareholder meeting, held Tuesday morning at the company's corporate headquarters in Durham, North Carolina USA, Cree President and CEO, Chuck Swoboda, announced that Cree is indeed moving up the vertical model and into packaged devices, starting with their power white advanced LED line. To date, Cree has stuck with supplying only SiC substrates, SiC on SiC wafers, GaN on SiC wafers, and GaN on SiC individual bare die. While they will continue to offer bare blue spectrum LED die in many hues and brightness, including white, the move upward in the supply chain to packaged parts will undoubtedly result in making Cree more competitive with the current USA leader in blue spectrum and other advanced LED offerings, namely Lumileds. Lumileds is made up of the same HP/Agilent development team where Chuck Swoboda began his advanced LED career prior to taking over the helm at Cree. And as Cree moves into the packaging of their high power SiC devices, the value added will be significant as that customer base has strong need for properly packaged devices that compliment the attributes of SiC and leading edge wide bandgap devices such as those based on GaN. Cree is clearly a specialist company in wide bandgap electronic device technology. Expert packaging of those devices makes Cree even more valuable to the compound semi industry. Calling their packaged blue spectrum LEDs precisely what they are, "lamps," the first packaged product family expected to catapult Cree quickly into the high power packaged blue spectrum LED arena is called XLamp. The new line combines Cree's XBright power chip with innovative packaging technology, and as Chuck explained to shareholders, that technology does not include phosphor coatings, a step which Cree will continue to leave to their customers. The XLamp product will be available in multiple colors for all applications and pre-production sampling of a 1 Watt surface mount XLamp device is targeted for early calendar year 2004 with initial production targeted for mid-year. Commenting in the news release, Chuck Swoboda said, "The introduction of the XLamp product family is the next step in our plan to drive the market for LED based lighting. We believe that our ability to offer a high power packaged LED product in addition to our power chip will be critical in accelerating the adoption of this important technology into the lighting market. Cree's will continue to focus on meeting the needs of our customers' chip requirements and will work aggressively to support applications utilizing our power chip." Company news release.

Lumileds Moves Warm Whites into Volume Shipping Mode

October 28, 2003...Lumileds Lighting of San Jose, California USA has pushed their "warm white" version of Luxeon HB-LEDs from sampling stage (where they indeed received a warm reception), into volume shipment mode. Stating that their version of warm white are the first blue spectrum industry's first truly warm whites to deliver production quantities, Lumileds warms boast a color rendering index (CRI) of 90, a correlated color temperature (CCT) of 3200K, and an average light output of 20 lumens that is up to 10 times brighter than standard LEDs, with an expected retention of 70% of its initial light output through 50,000 hours of operation under typical conditions. For those unacquainted with CRI's and CCTs and retention lifetimes, the new product essentially opens the door for significantly greater use of solid-state illumination in interior and task lighting applications by overcoming the resistance of lighting designers and consumers to the cooler blue tones of conventional white LEDs. Luxeon warm white provides an industry-leading In addition, it is the first solid-state light source to closely match the black body illuminant spectrum across the visible colored range. These characteristics, says Lumileds, based on advanced phosphor material technology developed by Lumileds engineers, make it possible for the first time to create LED-powered luminaires that achieve lighting effects comparable to those produced with incandescent and halogen bulbs. Potential applications range from hospitality lighting, including retail stores, restaurants and hotels, to luminaires and fixtures for display cases and cabinets, task and accent lighting, and cove and architectural lighting. Luxeon warm white emitters are immediately available in both unmounted and mounted form in the batwing radiation pattern. (Hmm... batwing design... just in time for Halloween!). Testimonials from a variety of early stage customers integrating Lumileds warm whites into their rather remarkable lighting systems are included in the company news release.

Lumidigm to Develop Anti-Spoofing Biometric Sensor for Unisys

October 28, 2003...Unisys Corporation has contracted with Lumidigm, Inc., of Albuquerque, New Mexico USA to help develop an anti-spoofing optical deep tissue biometric sensor that detects live tissue. The development contract is in support of a Research and Development Task Order Unisys has with the USA's DoD for Biometrics R&D Support. Lumidigm will use its core technology, which is called LumiGuard, to develop an anti-spoofing sensor, which they're calling LumiSure. The sensor measures liveness and other properties of live human tissue. The targeted application of the LumiSure technology will be to integrate the sensor with fingerprint and hand geometry sensors to reduce or eliminate the potential of fraud using artificial methods. Lumidigm is scheduled to deliver the first prototype sensor during the first quarter 2004. “Lumidigm is pleased to be partnered with Unisys to create this unique biometric sensor that will reduce or eliminate the most common ways to spoof fingerprint and hand geometry systems on the market today,” explained Lumidigm’s chairman and CEO, Bob Harbour. “As the federal government continues the wide-scale deployment of biometric solutions for heightened security, participation in projects like this, with Unisys, will provide us with the opportunity to further improve our state-of-the-art biometric technology." Lumidigm was established in July, 2001 as a separate, privately held, spin-off company from InLight Solutions. It is located in the Science & Technology Park at the University of New Mexico, in Albuquerque. Company news release

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Commentary & Perspective...

Taiwan's the Hot Spot for Blue 2004 in May

October 30, 2003...With the success of Blue 2003 last summer in Dallas, we had to ask, where should we hold the 2004 follow-on? Given the recent IP news and the incredible buildup of MOCVD GaN tools in Asia, especially in Taiwan, obviously that country becomes the hot spot for the production of blue spectrum devices as well as an increase in innovation that we don't hear as much about. Yet. But the handwriting is on the wall that innovation that leads to increased device performance and suitability, along with improvement in yields is what it will take to navigate around others' or lock in their own approaches to the advanced LED technology. So we're going to the heart of the Asian action with the follow-on to Blue 2003. To keep things simple, we'll call it Blue 2004 with the subtitle that expands what we'll cover.

Blue 2004: Advanced LEDs & Lasers, will be held May 11-12, 2004 in the Hsinchu area. This follow-on event will extend and broaden the topics of the original event. This first-of-its-kind international event will gather together the complete vertical market, from leading manufacturers and developers of advanced materials and processes, to devices and system assembly from across the globe. Featured speakers will be selected from companies at the leading edge in development of epitaxy, processing, test and measurement, as well as their materials and source providers, subsystem assemblers and contract manufacturers whose common goal is to promote the rapid deployment, acceptance, and mainstream market adoption of solid state semiconductor light emitting technologies and devices.

An important theme of the conference will be the international environmental impact and overall cost-saving aspects these exciting new device types bring to societies all over the world. Featured topics will include: High Brightness LEDs (HB-LEDs); Blue Spectrum LEDs (green, blue, violet, white and ultraviolet); Organic LEDs (OLEDs); Advanced Lasers and emerging technologies including Light Emitting Nanotechnology and MEMS-based light emitting devices. Mark your calendars now and keep watch for the conference web site coming soon!

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