TriQuint Unveils New WEDGE Product Portfolio for Qualcomm's 3G Chipset Solutions
Source/Type: News - Staff reports

Author: CompoundSemi News Staff

February 10, 2010... TriQuint Semiconductor of Hillsboro, Oregon USA, has released a new RF front-end solution to support 3G chipset solutions from Qualcomm. The new solution includes the Triton PA Module family for WCDMA and the TQM7M5013, a Hadron II PA Module for GSM/EDGE. The company contends that the solution comes in a very small footprint, is efficient, and is optimized for superior current consumption. Triquint says that the solution is ideal for mobile devices including data cards, netbooks, e-readers and next generation smartphones.

The new Triton PA Module family of 3x3mm discrete Power Amplifier Modules covers all major 3GPP WCDMA bands and is capable of multi-mode operation. According to TriQuint, the Triton family leverages a combination of it CuFlip and TQBiHEMT technologies to provide superior current consumption and thermal performance. CuFlip reportedly enables superior RF performance while allowing flexible design. TQBiHEMT can integrate two gallium arsenide (GaAs) processes onto a single die. Together, these processes allow TriQuint to provide an integrated feature set using a single die inside the module.

The TQM7M5013, a 5x5mm quad-band, Hadron II PA Module provides the GSM/EDGE portion of the WEDGE solution when paired with the Triton modules. The TQM7M5013's architecture reportedly improves efficiency and results in longer talk time for consumers. The company notes that TQM7M5013 is aligned with a recently released 3G Qualcomm chipset and is designed into more than a dozen platforms that are expected to launch in 2010. TriQuint News Release

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