Teledyne Wins $18.8M DARPA Contract to Develop Terahertz Technology
Source/Type: Reported News

Author: CompoundSemi News Staff

June 8, 2009... Teledyne Technologies Incorporated reports that its subsidiary Teledyne Scientific & Imaging, LLC (TS&I), was a awarded a contract from the Defense Advanced Research Project Agency's (DARPA) Microsystems Technology Office to develop terahertz electronics devices and integrated circuits. Under the contract which runs through 2014, TS&I hopes to develop and demonstrate transistor technology, circuit design, and circuit packaging to demonstrate receiver and transmitter blocks operating at frequencies greater than 1.0 THz. The 24-month, initial Phase 1 of the contract is valued at $8.3 million. The company notes that if all contract Phases proceed, the total contract value would be $18.8 million for work performed through 2014.

TS&I will reportedly leverage its high performance Indium Phosphide heterojuction bipolar transistor (HBT) technology. TS&I says it will scale transistors to dimensions of less than 100nm to extended into THz frequencies. Also, TS&I says that it will develope a silicon-micromachining process for forming batch manufactured waveguide blocks for circuit integration. The company reports that it has put together teams from NASA's Jet Propulsion Laboratory, University of California at Santa Barbara, University of California at San Diego and Raytheon Integrated Defense Systems to develop the technologies under the program that will benefit a large class of RF and mixed signal Defense Department applications. Teledyne News Release

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