CPS Introduces Revolutionary Metal Matrix Composite Flip-chip IC packaging solution offers high reliability and low cost
Source/Type: Company News Releases

March 9, 2005... CPS Corporation, the worldwide leader in the design and production of metal matrix composites, offers AlSiC (Aluminum Silicon Carbide), a metal matrix composite that provides high-performance lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.

Ideal for flip-chip lid applications, AlSiC enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies. Unlike traditional packaging materials, the isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. AlSiC’s CTE matching capabilities eliminate the need for thermal interface stacking, increasing reliability in the field.

AlSiC also exhibits a high thermal conductivity that results in extremely efficient thermal dissipation. Coupled with its superior CTE matching, AlSiC’s high thermal conductivity prevents the bowing and flexing of packaging and substrate material that can lead to failure. Traditional packaging materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.

The CPS AlSiC net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and allowing rapid prototyping for high volume advanced thermal management solutions. Less dense than traditional flip-chip packaging materials, AlSiC provides assembly yields at the customer level.

The unrestricted geometry of AlSiC enables the inclusion of complex features, such as capacitor or resistor pockets, in the flip-chip lids. The AlSiC cast surface supports various identification methods including, laser marking, paint, ink, and screen printing, as well as plating anodization and other surface metallization schemes typically applied to aluminum. The unique casting process also enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.

About CPS Corporation
CPS Corporation is the worldwide leader in the design and high-volume production of metal matrix composites. With over 30 years combined experience, CPS engineers and scientists use a net-shape fabrication process, including patented QuickSet™ injection molding and QuickCast™ infiltration. AlSiC components are utilized in applications in the wireless communications infrastructure, high-performance microprocessor, motor controller, and other microelectronic markets. CPS’ customers include TI, Motorola, HP, Agilent and Amkor. For more information on CPS’ AlSiC components, contact CPS at 1 (508) 222-0614 x42; e-mail marko@alsic.com, or visit www.alsic.com.

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