RF Communications

Soitec and IntelliEPI to Collaborate in Supplying Gallium Arsenide (GaAs) Market

Soitec, based in Bernin, France, and Intelligent Epitaxy Technology, Inc. of Taiwan have signed a collaborative agreement to better serve the GaAs market. Gallium arsenide (GaAs) is a III-V semiconductor used in the manufacture of devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits, infrared LEDs, laser diodes, …

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Peregrine Opens New Lab Facilities and Expands Technical Resources

Peregrine Semiconductor Corp of San Diego, California USA, a pioneer of RF SOI (silicon on insulator) and advanced RF solutions, announced completion of its 2013 initiative to deliver a higher level of customer support globally. The company has opened new lab facilities and expanded technical resources at its sales offices …

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Skyworks Front End Solutions Support Broadcom 5G WiFi Reference Designs

Skyworks Solutions, Inc. of Woburn, Massachusetts USA, announced that Broadcom Corporation is leveraging its wireless connectivity front-end modules (FEMs) in several of Broadcom’s 5G WiFi reference designs. Broadcom claims that its 5G WiFi solutions enable some of the fastest download speeds available in access points, routers, DSL/cable gateways, PCs, smartphones …

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Front-End Solutions from Skyworks Power MediaTek’s Latest Dual-core Smartphone Platform

Skyworks Solutions, Inc. of Woburn Massachusetts USA reports that MediaTek is leveraging several of its front-end solutions in their dual-core MT6572 platform for multiple tier-one smartphone manufacturers in emerging markets. MediaTek, a fabless semiconductor company for wireless communications, supplies complete chipset solutions that integrate their own baseband processor, radio, software, …

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IBM Scientists Create Prototype of Integrated Millimeter-Wave Transceiver for Mobile Communications and Radar Imaging

Scientists from IBM have created a SiGe BiCMOS-based prototype of a phased-array transceiver with the millimeter-wave components for both high data-rate communications and advanced-resolution radar imaging applications.  IBM says that the newly demonstrated integrated circuits (ICs) allow radar-imaging technology to be scaled down to the size of a computer laptop …

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Skyworks New Family of Antenna Switches Supports Carrier Aggregation

Skyworks Solutions, Inc. of Woburn, Massachusetts USA has introduced RF switching technology that is enabling early adopters to implement carrier aggregation solutions. Carrier aggregation allows mobile service providers to use utilizing two or more bands simultaneously instead of the single band method used currently to combine spectrum and increase data …

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TriQuint Produces GaN HEMTs Using GaN-on-Diamond Wafers

TriQuint Semiconductor, Inc. of Hillsboro, Oregon USA, announced the production of gallium nitride (GaN) high electron mobility transistors (HEMTs) using GaN-on-diamond wafers. The GaN-on-diamond wafers substantially reduce semiconductor temperatures while maintaining high RF performance. TriQuint successfully transfered a semiconductor epitaxial overlay onto a synthetic diamond substrate. This provides high thermal …

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Cree and Eta Devices to Demonstrate the Most Efficient Power Amplifier for Mobile Base Stations

Cree, Inc. and Eta Devices, Inc. will demonstrate what the company’s claim to be the world’s most efficient power amplifier for mobile base stations at the 2013 Mobile World Congress, February 24-28 in Barcelona, Spain. While current generation mobile base station amplifiers using silicon LDMOS transistors can provide amplifier efficiencies …

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Nujira Releases New 16-band ET RF Front-End for Global LTE Handsets

Nujira Ltd of Cambridge, UK, a maker of Envelope Tracking (ET) technology, released its new “Woodstock” 16-band Multi-Mode, Multi-Band (MMMB) ET reference design for 4G smartphone RF Front Ends. The new reference design uses the company’s NCT-L1200 ET chip. It covers up to 16 frequency bands from 700MHz to 2.7GHz …

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