MEMS

STMicroelectronics and University of Amsterdam Faculty of Science Cooperate on Bird Tracking Device

STMicroelectronics of Geneva and the University of Amsterdam (UvA) Faculty of Science have announced that a sophisticated bird-tracking system developed by the university is using advanced MEMS sensing technology from ST. The device weighs as little as a 20 euro cent coin or a US quarter and is smaller than …

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Delft University of Technology orders AIXTRON 4-inch Black Magic tool for interconnect and MEMS technologies

Aachen/Germany–AIXTRON AG today announced an order for one Black Magic CNT (carbon nanotube) deposition system from the Delft University of Technology, Netherlands. The system is installed in a 1×4 inch wafer configuration in the Class 10,000 cleanroom of the Delft Institute of Microsystems and Nanoelectronics (DIMES) at the Delft University …

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Veeco Enters Into Strategic Partnership with Daiyang Metal Co. of Korea to Provide CIGS Solar Cell Equipment

Veeco Receives Initial Multi-Million Dollar Order for CIGS Equipment Plainview, New York USA–Veeco Instruments Inc. (Nasdaq: VECO) announced today that it has entered into a strategic partnership with Daiyang Metal Co., Ltd. of Korea, a leader in the production of cold rolled stainless steel, to be its supplier of equipment …

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IQE launches new epitaxy services for enhanced MEMS capabilities

Cardiff, UK — IQE, the leading global supplier of advanced semiconductor wafer products and wafer services to the semiconductor industry, is pleased to announce that it has added an extensive range of new epitaxy services for enhanced MEMS capabilities. Engineered substrates enable the greatest degree of flexibility in both the …

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Toshiba Achieves Higher Hole Mobility for Future Generation CMOS Technology by Twisted Direct Silicon Bonding Technology

VLSI Symposia 2008 Tokyo–Toshiba Corporation today announced that, together with IBM Corporation, it has developed a higher performance CMOS FET, a high priority for advanced system LSI. The new technology matches the highest possible performance, and opens the way for further advances in process technology. Toshiba and IBM announced the …

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