CS Device Packagers/Integrators

Nordson ASYMTEK Presents Integrated Jetting Systems for Conformal Coating and PCBA

         at  SMT Hybrid Packaging Nuremberg, Stand 7-109 Award-winning Quantum Q-6800 will jet underfill for microelectronics manufacturing in the Future Packaging Line, Stand 6-434 Photo at: http://www.nordson.com/~/media/Images/Nordson/asymtek/PR-High-Resolution/Nordson-ASYMTEK-Conformal-Coating-Line Click here for larger photo Carlsbad, California, USA – Nordson ASYMTEK, a Nordson company (NASDAQ:NDSN), will present a triple-valve, closed-loop …

Read More

Hitachi Cable Claims First GaN Verticle Diode with High Reverse Breakdown Voltage of 3000V

Hitachi Cable has claimed the successful trial manufacturing of the first ever gallium nitride (GaN) vertical diode with a high reverse breakdown voltage of 3,000V or higher and a low on-resistance of about 1mΩcm2 in the forward direction. The development was the result of joint research with Toru Nakamura Laboratory …

Read More

Strategy Analytics Says Gallium Nitride Development Booming

Market research firm, Strategy Analytics contends that gallium nitride (GaN)-based products have been gaining acceptance in commercial markets. The company points out that EPC, Cree, Nitronex, M/A-COM Tech, Fujitsu, Microsemi, Renesas Electronics, Toshiba and Integra Technologies have announced new GaN-based products.

Read More

Strategy Analytics Forecasts Strong 2011 for Semiconductor Microelectronics Segment

Strategy Analytics (SA) foresees growth for the microelectronics segment of the compound semiconductor industry due to increased consumer demand for sophisticated electronic devices such as smart phones and tablets. The company points out that this demand has lead to many recent new product announcements. SA indicates that the semiconductor microelectronics …

Read More

Ascent Solar Externally Certifies Module Encapsulation Material for Its Flexible PV Laminate

-Modules Submitted for External Product Certification Thorton, Colorado USA–Ascent Solar Technologies, Inc., a developer of state of the art flexible thin-film solar modules, announced today that its packaging solution for flexible monolithically integrated CIGS modules has successfully passed a critical environmental testing milestone. An independent laboratory conducted a series of …

Read More

VT Silicon Selects TowerJazz for World’s First Fully Integrated 4G RF Front End IC

SiGe chosen instead of traditional, more expensive GaAs Market for 4G mobile devices expected to grow from 4.3M in 2009 to 50.1M in 2012 Atlanta, Georgia and Newport Beach, California USA–VT Silicon, a fabless semiconductor company, today announced it has selected TowerJazz, the global specialty foundry leader, to be its …

Read More

Fujitsu Develops World’s First Millimeter-Wave Gallium-Nitride Transceiver Amplifier Chipset

Kawasaki and Tokyo, Japan- Fujitsu Limited and Fujitsu Laboratories Ltd. announced today the development of the world’s first gallium-nitride(1)HEMT(2)-based transceiver amplifier chipset for broadband wireless transmission equipment operating in the millimeter bandwidth, the range of 70 to 100 GHz, for which widespread usage is expected to grow. The new transceiver …

Read More

Fujitsu Claims Development of First Millimeter-Wave Gallium-Nitride Transceiver Amplifier Chipset

Fujitsu Limited and Fujitsu Laboratories Ltd. of Kawasaki and Tokyo, Japan respectively, announced the development of what they claim is the first gallium nitride HEMT-based tranceiver amplifier chipset. The chipset is reportedly for broadband wireless transmission equipment operating in the millimeter bandwidth, the range of 70 to 100 GHz, for …

Read More