Other Manufacturing Equipment

EV Group Begins Corporate Headquarters Expansion

EV Group (EVG), an Austrian-based supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, reported that the company has begun the construction on the next expansion phase of its corporate headquarters in St. Florian. The new building will house EV Group’s “Manufacturing III” facility. The …

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Eulitha Gets Photolithography System Order from Lund University for Nanowire Growth

Swiss startup Eulitha, reported that Lund University in Sweden ordered one of its PhableR 100 DUV photolithography systems. Eulitha AG, a spin-off company of the Paul Scherrer Institute, Switzerland, specializes in developing lithographic technologies for applications in optoelectronics and photonics.  The University’s nanofabrication facility, which is operated by NanoLund, the …

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SPTS Gets Orders for Multiple Etch and Deposition Systems From GaAs Foundry Customers

SPTS Technologies, an Orbotech company based in Yavne, Israel, received about $37M in orders for multiple etch and deposition systems from two GaAs foundry customers. The customers who ordered the Omega® plasma etch, Delta® PECVD, and Sigma® PVD systems intend to use them to fabricate 4G and emerging 5G radio frequency …

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Solliance Achieves New Perovskite Efficiency World Record with R2R Fabrication

Solliance reports that the consortium’s perovskite-based photovoltaics have achieved module-level aperture area conversion efficiency of 12.2% and world record cell-level conversion efficiency of 13.5%. The company used roll-to-roll (R2R) production processes.  This latest record follows the consortium’s previous perovskite cell world record reported earlier this year. Perovskite-based solar cells promise …

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Akhan Semiconductor Issued Japanese Patent for Diamond Semiconductor Fabrication

Akhan Semiconductor of Chicago, Illinois USA, reported that the Japan Patent Office has awarded the company a patent covering a process for producing diamond semiconductor materials. Such diamond semiconductor materials can be utilized in aerospace, automotive, military, defense, telecommunications, and consumer electronics applications. The Japanese patent granted to Akhan, JP6195831 …

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NCSU Researchers Introduce PRESiCE™ SiC Manufacturing Process to Lower Cost for Entering SiC Power Device Market

North Carolina State University researchers are introducing a new manufacturing process and chip design for silicon carbide (SiC) power devices. The team developed the process called PRESiCE™ with support from Department of Energy’s the PowerAmerica Institute. The goal of the new process is to make entry into the SiC marketplace …

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