Other Manufacturing Equipment

NCSU Researchers Introduce PRESiCE™ SiC Manufacturing Process to Lower Cost for Entering SiC Power Device Market

North Carolina State University researchers are introducing a new manufacturing process and chip design for silicon carbide (SiC) power devices. The team developed the process called PRESiCE™ with support from Department of Energy’s the PowerAmerica Institute. The goal of the new process is to make entry into the SiC marketplace …

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AP&S Expands Demo Center

In 2016 AP&S International GmbH nearly tripled the size of its in-house laboratory from 23m3 to 66 m3. Since it reopened in 2017, the newly expanded laboratory, called the Demo Center, offers a variety of single wafer process demonstrations for customers from all over the world.AP&S says it understands that …

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Ulvac Opens Santa Clara Office

Ulvac Technologies, Inc. of Japan, a supplier of instrumentation, production systems, and vacuum pumps for high-tech industries has opened an office in Santa Clara, California. The company says that the Silicon Valley office location gives its West Coast customers easier access to the company’s sales and service operations. Ulvac points …

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EV Group Wins Austrian Innovation Award

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment based in St. Florian, Austria, has received the 2017 Austrian Innovation Award, known as the “Staatspreis Innovation 2017”. Judges chose the award winning company from 485 competing firms in the 37th Austrian Innovation Awards. Austria Wirtschaftsservice GmbH (aws) …

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Hua Hong Semiconductor Introduces Third Generation SJNFET Process Platform

Hua Hong Semiconductor Limited of Hong Kong, a pure-play 200mm foundry, reports that it has concluded the Stage I of its R&D for the third-generation Super Junction MOSFET (SJNFET) process platform. The company plans to introduce its process platform to the market gradually during the first half of 2017. Hua …

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