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Blue 2004 Pre-Conference Workshop
Hsinchu, Taiwan May 10, 2004 |
High Power LED Packaging
| The need to produce very high lumen output LEDs operating at high current require the development of packaging technology that can rapidly remove heat from the LEDs. High power LED packaging places new demands on chip design, die attach, submount design, encapsulation and lead frame design. This workshop will address the challenges of high power LED packaging and discuss some of the new materials and technologies that are being developed to produce high power LED packages providing low thermal resistance, good optical performance and acceptable operating life. |
Monday, May 10, 12:30 to 3:30 PM in the Mezzanine A/B rooms, 13th floor
Joe Mazzochette, Vice President of Engineering at Lamina
- Why do we need heat management for HB LEDs?
- Thermal design and analysis basics
- The Lamina light engine technology
- Heat spreading
- Thermal expansion
- Thermal stress analysis
Robert F. Karlicek, Jr., Director of LED Development at Microsemi Corporation
- Die Design
- Leadframe Design Considerations
- Die Attach Technologies for Low Impedance
- Encapsulants for Photothermal Stability
- Capital Equipment Issues for Low Cost Assembly
- Conclusions
| Packaging Workshop - 1st Attendee |
$240
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(NT$7995)
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| Packaging Workshop - Additional Attendees |
$150
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(NT$4995)
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You can register
right now on our secure server,
or by contacting us at +1 512 257-9888 or via email at
blue2004 @ compoundsemi.com
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Blue 2004: Advanced
LEDs & Lasers will be well attended by financial
and market analysts, industry press, financial catalysts, and senior
managers of the companies actually driving blue spectrum development...
across the entire supply chain.
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