ADVA Optical Networking to Collaborate on Project to Embed III-V Lasers on Silicon

ADVA Optical Networking of Munich, Germany, announced that it is playing a key role in the Directly Modulated Lasers on Silicon (DIMENSION) project. The DIMENSION project brings together a consortium of research and industry partners from four European countries to develop a platform for single-chip electro-optical integration. Dresden University of Technology coordinates the DIMENSION project among the partners from Germany, UK, Switzerland, and Greece. The two included research are Innovations for High Performance Microelectronics and Athens Information Technology. In addition to ADVA Optical Networking, industry partners include Optocap and IBM Research of Zurich. The project aims to develop active III-V material lasers embedded into silicon photonics chips. Such III-V lasers on silicon will become the versatile, cost-efficient components needed to optimize data center interconnect (DCI) transport for the next generation of data centers.

“DIMENSION unites specialists from different fields and enables us to address the complete value chain of directly modulated lasers, from materials research to application,” said Bert Offrein, manager, photonics, IBM Research of Zurich. “Our role is to design and produce the integrated active optical components. This technology will bring the optics to where the data is generated and that leads to improvements in every part of the data center. By enhancing interconnections at different reaches, from centimeters up to kilometers, we’ll be able to reduce size, cost and power on links between boards, computers and facilities.”

“Improving efficiency in the DCI couldn’t be more vital given the increasing demand for cloud computing and the growing scale of the internet of things,” commented Michael Eiselt, director, advanced technology, ADVA Optical Networking. “Much of our recent innovation has centered on enhancing the DCI, such as our FSP 3000 CloudConnect™ solution. By integrating the three distinct technologies of silicon photonics, electronics, and active photonics, we’re giving data centers what they need to meet tomorrow’s demands. ”

The four-year project is funded by the European Union’s Horizon 2020 research and innovation program.